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LibreCat: /record/10334
DOI: 10.1016/j.sna.2019.04.025

Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).
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Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., &; Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
LibreCat: /record/9993