Aimiyekagbon OK, Bender A, Hemsel T, Sextro W. Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions. Electronics. 2024;13(3). doi:10.3390/electronics13030521

Dymel C. Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten. Vol 16. Shaker Verlag; 2024.

Althoff S. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol 15. Shaker; 2023.

Dunst P. Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse. Vol 14. Shaker; 2023.

Bender A. Model-based condition monitoring of piezoelectric bending actuators. Sensors and Actuators A: Physical. 2023;357. doi:10.1016/j.sna.2023.114399

Wohlleben MC, Muth L, Peitz S, Sextro W. Transferability of a discrepancy model for the dynamics of electromagnetic oscillating circuits. In: Proceedings in Applied Mathematics and Mechanics. Wiley; 2023. doi:10.1002/pamm.202300039

Aimiyekagbon OK, Löwen A, Bender A, Muth L, Sextro W. Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System. In: Proceedings of the Asia Pacific Conference of the PHM Society 2023 . Vol 4. ; 2023. doi:10.36001/phmap.2023.v4i1.3596

Sehlmeyer B, Kampmann R, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells. In: Deutsche Physikalische Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM). ; 2023.

Kampmann R, Sehlmeyer B, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells. In: Deutsche Physikalische Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM). ; 2023.

Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. In: ; 2023.

Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. In: ; 2023.

Scheidemann C, Hagedorn OEC, Hemsel T, Sextro W. Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. In: ; 2023.

Schütte J, Sextro W. Einfluss der Radhubkinematik auf den Reifenverschleiß. In: 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn. Vol 2425. VDI-Berichte. VDI Verlag GmbH; 2023:165-180.

Schemmel R. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Vol 13. Shaker; 2022. doi:10.17619/UNIPB/1-1280

Muth L, Noll C, Sextro W. Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data. In: Orlova A, Cole D, eds. Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021. Lecture Notes in Mechanical Engineering. Springer; 2022. doi:10.1007/978-3-031-07305-2_92

Hemsel T, Twiefel J. Piezoelectric Ultrasonic Power Transducers. In: Reference Module in Materials Science and Materials Engineering. Elsevier; 2022. doi:10.1016/b978-0-12-819728-8.00047-4

Wohlleben MC, Bender A, Peitz S, Sextro W. Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction. In: Machine Learning, Optimization, and Data Science. Springer International Publishing; 2022. doi:10.1007/978-3-030-95470-3_8

Hagedorn OEC, Broll M, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. In: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems. VDE VERLAG GMBH; 2022:138-143.

Aimiyekagbon OK, Bender A, Sextro W. On the applicability of time series features as health indicators for technical systems operating under varying conditions.  Condition Monitor. 2022:5-10.

Scheidemann C, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE; 2022. doi:10.1109/estc55720.2022.9939478