Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process
C. Scheidemann, O.E.C. Hagedorn, T. Hemsel, W. Sextro, in: 2023.
LibreCat: /record/51119

Piezoelectric Ultrasonic Power Transducers
T. Hemsel, J. Twiefel, in: Reference Module in Materials Science and Materials Engineering, Elsevier, 2022.
LibreCat: /record/33500
DOI: 10.1016/b978-0-12-819728-8.00047-4

Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding
O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, Berlin, 2022, pp. 138–143.
LibreCat: /record/30371

Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding
C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.
LibreCat: /record/34104
DOI: 10.1109/estc55720.2022.9939478

Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen
C. Scheidemann, T. Hemsel, W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen, LibreCat University, 2022.
LibreCat: /record/52045
DOI: 10.2314/KXP:1879655276

Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077

Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
LibreCat: /record/17355

Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020.
LibreCat: /record/17706
DOI: 10.1109/eurosime48426.2020.9152679

Atomization of Fluids with Ultrasound
P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, W. Sextro, in: J. Lötters, G. Urban (Eds.), Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MF), Enschede, The Netherlands, 2019, pp. 140–143.
LibreCat: /record/14852

Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen
O.E.C. Hagedorn, D. Pielsticker, T. Hemsel, W. Sextro, in: 2. VDI-Fachtagung Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.
LibreCat: /record/15244

Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten
P. Dunst, T. Hemsel, P. Bornmann, W. Littmann, W. Sextro, in: DAGA 2019, 2019.
LibreCat: /record/10258

Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.
LibreCat: /record/10334
DOI: 10.1016/j.sna.2019.04.025

Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders
P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, W. Sextro, ACTUATOR 2018; 16th International Conference on New Actuators (2018) 142–145.
LibreCat: /record/9990

Vibration-Assisted Handling of Dry Fine Powders
P. Dunst, P. Bornmann, T. Hemsel, W. Sextro, Actuators 2018, 7(2). (2018) 1–11.
LibreCat: /record/9991
DOI: 10.3390/act7020018

Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat: /record/9992

Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat: /record/9993

Numerical and experimental investigations in ultrasonic heavy wire bonding
R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.
LibreCat: /record/9998

Analysis of pipe vibration in an ultrasonic powder transportationsystem
P. Dunst, T. Hemsel, W. Sextro, Elsevier Sensors and Actuators A 263 (2017) 733–736.
LibreCat: /record/9972

Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing
J.K. Kimotho, W. Sextro, T. Hemsel, in: IEEE Transactions on Reliability, 2017, pp. 1–10.
LibreCat: /record/9978
DOI: 10.1109/TR.2017.2710260

MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall
R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.
LibreCat: /record/9982