Aimiyekagbon, O. K., Bender, A., Hemsel, T., &; Sextro, W. (2024). Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions. Electronics, 13(3), Article 521.https://doi.org/10.3390/electronics13030521 
LibreCat: /record/51518
DOI: 10.3390/electronics13030521

Sehlmeyer, B., Kampmann, R., Scheidemann, C., Hemsel, T., &; Getzlaff, M. (2023). Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM).
LibreCat: /record/47234

Kampmann, R., Sehlmeyer, B., Scheidemann, C., Hemsel, T., &; Getzlaff, M. (2023). Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM).
LibreCat: /record/47235

Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., &; Sextro, W. (2023). Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea.
LibreCat: /record/51117

Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., &; Sextro, W. (2023). Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. International Conference on Functional Materials &; Devices 2023 (ICFMD 2023), Incheon, Korea.
LibreCat: /record/51118

Scheidemann, C., Hagedorn, O. E. C., Hemsel, T., &; Sextro, W. (2023). Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. International Conference on Functional Materials &; Devices 2023 (ICFMD 2023), Jeju, Korea.
LibreCat: /record/51119

Hemsel, T., &; Twiefel, J. (2022). Piezoelectric Ultrasonic Power Transducers. In Reference Module in Materials Science and Materials Engineering. Elsevier.https://doi.org/10.1016/b978-0-12-819728-8.00047-4 
LibreCat: /record/33500
DOI: 10.1016/b978-0-12-819728-8.00047-4

Hagedorn, O. E. C., Broll, M., Kirsch, O., Hemsel, T., &; Sextro, W. (2022). Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–143.
LibreCat: /record/30371

Scheidemann, C., Kirsch, O., Hemsel, T., &; Sextro, W. (2022). Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).https://doi.org/10.1109/estc55720.2022.9939478 
LibreCat: /record/34104
DOI: 10.1109/estc55720.2022.9939478

Scheidemann, C., Hemsel, T., &; Sextro, W. (2022). Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University.https://doi.org/10.2314/KXP:1879655276 
LibreCat: /record/52045
DOI: 10.2314/KXP:1879655276

Schemmel, R., Krieger, V., Hemsel, T., &; Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077.https://doi.org/10.1016/j.microrel.2021.114077 
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077

Schemmel, R., Scheidemann, C., Hemsel, T., Kirsch, O., &; Sextro, W. (2020). Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6.
LibreCat: /record/17355

Schemmel, R., Krieger, V., Hemsel, T., &; Sextro, W. (2020). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).https://doi.org/10.1109/eurosime48426.2020.9152679 
LibreCat: /record/17706
DOI: 10.1109/eurosime48426.2020.9152679

Dunst, P., Bornmann, P., Hemsel, T., Littmann, W., &; Sextro, W. (2019). Atomization of Fluids with Ultrasound. In J. Lötters &; G. Urban (Eds.), Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MF) (pp. 140–143). Enschede, The Netherlands.
LibreCat: /record/14852

Hagedorn, O. E. C., Pielsticker, D., Hemsel, T., &; Sextro, W. (2019). Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen. In 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019.
LibreCat: /record/15244

Dunst, P., Hemsel, T., Bornmann, P., Littmann, W., &; Sextro, W. (2019). Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten. In DAGA 2019. Rostock.
LibreCat: /record/10258

Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &; Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical, 295, 653–662.https://doi.org/10.1016/j.sna.2019.04.025 
LibreCat: /record/10334
DOI: 10.1016/j.sna.2019.04.025

Dunst, P., Bornmann, P., Hemsel, T., Littmann, W., &; Sextro, W. (2018). Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders. ACTUATOR 2018; 16th International Conference on New Actuators, 142–145.
LibreCat: /record/9990

Dunst, P., Bornmann, P., Hemsel, T., &; Sextro, W. (2018). Vibration-Assisted Handling of Dry Fine Powders. Actuators 2018, 7(2)., 1–11.https://doi.org/10.3390/act7020018 
LibreCat: /record/9991
DOI: 10.3390/act7020018

Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).
LibreCat: /record/9992