O. K. Aimiyekagbon, A. Bender, T. Hemsel, and W. Sextro, “Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions,”10.3390/electronics13030521__Electronics, vol. 13, no. 3, Art. no. 521, 2024, doi:10.3390/electronics13030521 .
LibreCat: /record/51518
DOI: 10.3390/electronics13030521

B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), Dresden, 2023.
LibreCat: /record/47234

R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), Dresden, 2023.
LibreCat: /record/47235

C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea, 2023.
LibreCat: /record/51117

C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the International Conference on Functional Materials &; Devices 2023 (ICFMD 2023), Incheon, Korea, 2023.
LibreCat: /record/51118

C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” presented at the International Conference on Functional Materials &; Devices 2023 (ICFMD 2023), Jeju, Korea, 2023.
LibreCat: /record/51119

T. Hemsel and J. Twiefel, “Piezoelectric Ultrasonic Power Transducers,” in Reference Module in Materials Science and Materials Engineering, Elsevier, 2022.
LibreCat: /record/33500
DOI: 10.1016/b978-0-12-819728-8.00047-4

O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding,” in CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, Berlin, 2022, pp. 138–143.
LibreCat: /record/30371

C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding,”10.1109/estc55720.2022.9939478__2022, doi:10.1109/estc55720.2022.9939478 .
LibreCat: /record/34104
DOI: 10.1109/estc55720.2022.9939478

C. Scheidemann, T. Hemsel, and W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022.
LibreCat: /record/52045
DOI: 10.2314/KXP:1879655276

R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,”https://doi.org/10.1016/j.microrel.2021.114077__Microelectronics Reliability, vol. 119, p. 114077, 2021, doi:https://doi.org/10.1016/j.microrel.2021.114077 .
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077

R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
LibreCat: /record/17355

R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,”10.1109/eurosime48426.2020.9152679__2020, doi:10.1109/eurosime48426.2020.9152679 .
LibreCat: /record/17706
DOI: 10.1109/eurosime48426.2020.9152679

P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Atomization of Fluids with Ultrasound,” in Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MF), Enschede, The Netherlands, 2019, pp. 140–143.
LibreCat: /record/14852

O. E. C. Hagedorn, D. Pielsticker, T. Hemsel, and W. Sextro, “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen,” in 2. VDI-Fachtagung Schwingungen 2019, 2019.
LibreCat: /record/15244

P. Dunst, T. Hemsel, P. Bornmann, W. Littmann, and W. Sextro, “Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten,” in DAGA 2019, Rostock, 2019.
LibreCat: /record/10258

R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,”10.1016/j.sna.2019.04.025__Sensors and Actuators A: Physical, vol. 295, pp. 653–662, 2019, doi:10.1016/j.sna.2019.04.025 .
LibreCat: /record/10334
DOI: 10.1016/j.sna.2019.04.025

P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders,” ACTUATOR 2018; 16th International Conference on New Actuators, pp. 142–145, 2018.
LibreCat: /record/9990

P. Dunst, P. Bornmann, T. Hemsel, and W. Sextro, “Vibration-Assisted Handling of Dry Fine Powders,” Actuators 2018, 7(2)., pp. 1–11, 2018.
LibreCat: /record/9991
DOI: 10.3390/act7020018

C. Dymel et al., “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat: /record/9992