@articleAimiyekagbon_Bender_Hemsel_Sextro_2024, title=Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions, volume=13, DOI=10.3390/electronics13030521, number=3521, journal=Electronics, publisher=MDPI AG, author=Aimiyekagbon, Osarenren Kennedy and Bender, Amelie and Hemsel, Tobias and Sextro, Walter, year=2024 

@inproceedingsSehlmeyer_Kampmann_Scheidemann_Hemsel_Getzlaff_2023, title=Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells, booktitle=Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), author=Sehlmeyer, Birte and Kampmann, Rebecca  and Scheidemann, Claus and Hemsel, Tobias and Getzlaff, Mathias , editor=Deutsche Physikalische Gesellschaft e. V., year=2023 

@inproceedingsKampmann_Sehlmeyer_Scheidemann_Hemsel_Getzlaff_2023, title=Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells, booktitle=Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), author=Kampmann, Rebecca and Sehlmeyer, Birte and Scheidemann, Claus and Hemsel, Tobias and Getzlaff, Mathias, editor=Deutsche Physikalische Gesellschaft e. V., year=2023 

@inproceedingsScheidemann_Hemsel_Friesen_Claes_Sextro_2023, title=Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics, author=Scheidemann, Claus and Hemsel, Tobias and Friesen, Olga and Claes, Leander and Sextro, Walter, year=2023 

@inproceedingsScheidemann_Hemsel_Friesen_Claes_Sextro_2023, title=Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics, author=Scheidemann, Claus and Hemsel, Tobias and Friesen, Olga and Claes, Leander and Sextro, Walter, year=2023 

@inproceedingsScheidemann_Hagedorn_Hemsel_Sextro_2023, title=Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process, author=Scheidemann, Claus and Hagedorn, Oliver Ernst Caspar and Hemsel, Tobias and Sextro, Walter, year=2023 

@inbookHemsel_Twiefel_2022, title=Piezoelectric Ultrasonic Power Transducers, DOI=10.1016/b978-0-12-819728-8.00047-4, booktitle=Reference Module in Materials Science and Materials Engineering, publisher=Elsevier, author=Hemsel, Tobias and Twiefel, Jens, year=2022 

@inproceedingsHagedorn_Broll_Kirsch_Hemsel_Sextro_2022, place=Berlin, title=Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding, booktitle=CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, publisher=VDE VERLAG GMBH, author=Hagedorn, Oliver Ernst Caspar and Broll, Marian and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter, year=2022, pages=138–143 

@inproceedingsScheidemann_Kirsch_Hemsel_Sextro_2022, title=Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding, DOI=10.1109/estc55720.2022.9939478, booktitle=2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), publisher=IEEE, author=Scheidemann, Claus and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter, year=2022 

@bookScheidemann_Hemsel_Sextro_2022, title=Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen, DOI=10.2314/KXP:1879655276, publisher=LibreCat University, author=Scheidemann, Claus and Hemsel, Tobias and Sextro, Walter, year=2022 

@articleSchemmel_Krieger_Hemsel_Sextro_2021, title=Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization, volume=119, DOI=https://doi.org/10.1016/j.microrel.2021.114077, journal=Microelectronics Reliability, author=Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter, year=2021, pages=114077 

@inproceedingsSchemmel_Scheidemann_Hemsel_Kirsch_Sextro_2020, title=Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding, booktitle=CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, author=Schemmel, Reinhard and Scheidemann, Claus and Hemsel, Tobias and Kirsch, Olaf  and Sextro, Walter, year=2020, pages=1–6 

@inproceedingsSchemmel_Krieger_Hemsel_Sextro_2020, title=Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization, DOI=10.1109/eurosime48426.2020.9152679, booktitle=2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), author=Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter, year=2020 

@inproceedingsDunst_Bornmann_Hemsel_Littmann_Sextro_2019, place=Enschede, The Netherlands, title=Atomization of Fluids with Ultrasound, booktitle=Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MF), author=Dunst, Paul and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter  and Sextro, Walter, editor=Lötters, Joost and Urban, GeraldEditors, year=2019, pages=140–143 

@inproceedingsHagedorn_Pielsticker_Hemsel_Sextro_2019, title=Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen, booktitle=2. VDI-Fachtagung Schwingungen 2019, publisher=VDI Verlag GmbH · Düsseldorf 2019, author=Hagedorn, Oliver Ernst Caspar and Pielsticker, Daniel and Hemsel, Tobias and Sextro, Walter, year=2019 

@inproceedingsDunst_Hemsel_Bornmann_Littmann_Sextro_2019, title=Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten, booktitle=DAGA 2019, author=Dunst, Paul and Hemsel, Tobias and Bornmann, Peter and Littmann, Walter  and Sextro, Walter, year=2019 

@articleSchemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title=Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding, volume=295, DOI=10.1016/j.sna.2019.04.025, journal=Sensors and Actuators A: Physical, author=Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter, year=2019, pages=653–662 

@articleDunst_Bornmann_Hemsel_Littmann_Sextro_2018, title=Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders, journal=ACTUATOR 2018; 16th International Conference on New Actuators, author=Dunst, Paul and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter. and Sextro, Walter, year=2018, pages=142–145 

@articleDunst_Bornmann_Hemsel_Sextro_2018, title=Vibration-Assisted Handling of Dry Fine Powders, DOI=10.3390/act7020018, journal=Actuators 2018, 7(2)., author=Dunst, Paul and Bornmann, Peter and Hemsel, Tobias and Sextro, Walter, year=2018, pages=1–11 

@inproceedingsDymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title=Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process, booktitle=(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), author=Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter, year=2018, pages=1–6