Aimiyekagbon OK, Bender A, Hemsel T, Sextro W. Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions. Electronics. 2024;13(3). doi:10.3390/electronics13030521
LibreCat: /record/51518
DOI: 10.3390/electronics13030521

Sehlmeyer B, Kampmann R, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells. In: Deutsche Physikalische Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM). ; 2023.
LibreCat: /record/47234

Kampmann R, Sehlmeyer B, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells. In: Deutsche Physikalische Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM). ; 2023.
LibreCat: /record/47235

Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. In: ; 2023.
LibreCat: /record/51117

Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. In: ; 2023.
LibreCat: /record/51118

Scheidemann C, Hagedorn OEC, Hemsel T, Sextro W. Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. In: ; 2023.
LibreCat: /record/51119

Hemsel T, Twiefel J. Piezoelectric Ultrasonic Power Transducers. In: Reference Module in Materials Science and Materials Engineering. Elsevier; 2022. doi:10.1016/b978-0-12-819728-8.00047-4
LibreCat: /record/33500
DOI: 10.1016/b978-0-12-819728-8.00047-4

Hagedorn OEC, Broll M, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. In: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems. VDE VERLAG GMBH; 2022:138-143.
LibreCat: /record/30371

Scheidemann C, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE; 2022. doi:10.1109/estc55720.2022.9939478
LibreCat: /record/34104
DOI: 10.1109/estc55720.2022.9939478

Scheidemann C, Hemsel T, Sextro W. Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University; 2022. doi:10.2314/KXP:1879655276
LibreCat: /record/52045
DOI: 10.2314/KXP:1879655276

Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability. 2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077

Schemmel R, Scheidemann C, Hemsel T, Kirsch O, Sextro W. Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. In: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems. ; 2020:1-6.
LibreCat: /record/17355

Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). ; 2020. doi:10.1109/eurosime48426.2020.9152679
LibreCat: /record/17706
DOI: 10.1109/eurosime48426.2020.9152679

Dunst P, Bornmann P, Hemsel T, Littmann W, Sextro W. Atomization of Fluids with Ultrasound. In: Lötters J, Urban G, eds. Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MF). Enschede, The Netherlands; 2019:140-143.
LibreCat: /record/14852

Hagedorn OEC, Pielsticker D, Hemsel T, Sextro W. Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen. In: 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019; 2019.
LibreCat: /record/15244

Dunst P, Hemsel T, Bornmann P, Littmann W, Sextro W. Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten. In: DAGA 2019. ; 2019.
LibreCat: /record/10258

Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025
LibreCat: /record/10334
DOI: 10.1016/j.sna.2019.04.025

Dunst P, Bornmann P, Hemsel T, Littmann W, Sextro W. Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders. ACTUATOR 2018; 16th International Conference on New Actuators. 2018:142-145.
LibreCat: /record/9990

Dunst P, Bornmann P, Hemsel T, Sextro W. Vibration-Assisted Handling of Dry Fine Powders. Actuators 2018, 7(2). 2018:1-11. doi:10.3390/act7020018
LibreCat: /record/9991
DOI: 10.3390/act7020018

Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany). ; 2018:1-6.
LibreCat: /record/9992