Aimiyekagbon, O. K., Bender, A., Hemsel, T., &; Sextro, W. (2024). Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions. Electronics, 13(3), Article 521.https://doi.org/10.3390/electronics13030521 

Sehlmeyer, B., Kampmann, R., Scheidemann, C., Hemsel, T., &; Getzlaff, M. (2023). Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM).

Kampmann, R., Sehlmeyer, B., Scheidemann, C., Hemsel, T., &; Getzlaff, M. (2023). Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM).

Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., &; Sextro, W. (2023). Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea.

Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., &; Sextro, W. (2023). Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. International Conference on Functional Materials &; Devices 2023 (ICFMD 2023), Incheon, Korea.

Scheidemann, C., Hagedorn, O. E. C., Hemsel, T., &; Sextro, W. (2023). Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. International Conference on Functional Materials &; Devices 2023 (ICFMD 2023), Jeju, Korea.

Hemsel, T., &; Twiefel, J. (2022). Piezoelectric Ultrasonic Power Transducers. In Reference Module in Materials Science and Materials Engineering. Elsevier.https://doi.org/10.1016/b978-0-12-819728-8.00047-4 

Hagedorn, O. E. C., Broll, M., Kirsch, O., Hemsel, T., &; Sextro, W. (2022). Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–143.

Scheidemann, C., Kirsch, O., Hemsel, T., &; Sextro, W. (2022). Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).https://doi.org/10.1109/estc55720.2022.9939478 

Scheidemann, C., Hemsel, T., &; Sextro, W. (2022). Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University.https://doi.org/10.2314/KXP:1879655276 

Schemmel, R., Krieger, V., Hemsel, T., &; Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077.https://doi.org/10.1016/j.microrel.2021.114077 

Schemmel, R., Scheidemann, C., Hemsel, T., Kirsch, O., &; Sextro, W. (2020). Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6.

Schemmel, R., Krieger, V., Hemsel, T., &; Sextro, W. (2020). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).https://doi.org/10.1109/eurosime48426.2020.9152679 

Dunst, P., Bornmann, P., Hemsel, T., Littmann, W., &; Sextro, W. (2019). Atomization of Fluids with Ultrasound. In J. Lötters &; G. Urban (Eds.), Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MF) (pp. 140–143). Enschede, The Netherlands.

Hagedorn, O. E. C., Pielsticker, D., Hemsel, T., &; Sextro, W. (2019). Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen. In 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019.

Dunst, P., Hemsel, T., Bornmann, P., Littmann, W., &; Sextro, W. (2019). Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten. In DAGA 2019. Rostock.

Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &; Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical, 295, 653–662.https://doi.org/10.1016/j.sna.2019.04.025 

Dunst, P., Bornmann, P., Hemsel, T., Littmann, W., &; Sextro, W. (2018). Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders. ACTUATOR 2018; 16th International Conference on New Actuators, 142–145.

Dunst, P., Bornmann, P., Hemsel, T., &; Sextro, W. (2018). Vibration-Assisted Handling of Dry Fine Powders. Actuators 2018, 7(2)., 1–11.https://doi.org/10.3390/act7020018 

Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).