Aimiyekagbon, Osarenren Kennedy, Amelie Bender, Tobias Hemsel, and Walter Sextro. “Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions.”https://doi.org/10.3390/electronics13030521__Electronics 13, no. 3 (2024).https://doi.org/10.3390/electronics13030521 .

Sehlmeyer, Birte, Rebecca  Kampmann, Claus Scheidemann, Tobias Hemsel, and Mathias  Getzlaff. “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.

Kampmann, Rebecca, Birte Sehlmeyer, Claus Scheidemann, Tobias Hemsel, and Mathias Getzlaff. “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.

Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023.

Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023.

Scheidemann, Claus, Oliver Ernst Caspar Hagedorn, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” 2023.

Hemsel, Tobias, and Jens Twiefel. “Piezoelectric Ultrasonic Power Transducers.”https://doi.org/10.1016/b978-0-12-819728-8.00047-4__In Reference Module in Materials Science and Materials Engineering. Elsevier, 2022.https://doi.org/10.1016/b978-0-12-819728-8.00047-4 .

Hagedorn, Oliver Ernst Caspar, Marian Broll, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” In CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–43. Berlin: VDE VERLAG GMBH, 2022.

Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.”https://doi.org/10.1109/estc55720.2022.9939478__In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE, 2022.https://doi.org/10.1109/estc55720.2022.9939478 .

Scheidemann, Claus, Tobias Hemsel, and Walter Sextro. Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022.https://doi.org/10.2314/KXP:1879655276 .

Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”https://doi.org/10.1016/j.microrel.2021.114077__Microelectronics Reliability 119 (2021): 114077.https://doi.org/10.1016/j.microrel.2021.114077 .

Schemmel, Reinhard, Claus Scheidemann, Tobias Hemsel, Olaf  Kirsch, and Walter Sextro. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic Heavy Wire Bonding.” In CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6, 2020.

Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”https://doi.org/10.1109/eurosime48426.2020.9152679__In 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020.https://doi.org/10.1109/eurosime48426.2020.9152679 .

Dunst, Paul, Peter Bornmann, Tobias Hemsel, Walter  Littmann, and Walter Sextro. “Atomization of Fluids with Ultrasound.” In Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MF), edited by Joost Lötters and Gerald Urban, 140–43. Enschede, The Netherlands, 2019.

Hagedorn, Oliver Ernst Caspar, Daniel Pielsticker, Tobias Hemsel, and Walter Sextro. “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen.” In 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019, 2019.

Dunst, Paul, Tobias Hemsel, Peter Bornmann, Walter  Littmann, and Walter Sextro. “Modellbasierte Und Experimentelle Charakterisierung von Intensiven Ultraschall-Stehwellenfeldern Für Die Zerstäubung Hochviskoser Flüssigkeiten.” In DAGA 2019, 2019.

Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.”https://doi.org/10.1016/j.sna.2019.04.025__Sensors and Actuators A: Physical 295 (2019): 653–62.https://doi.org/10.1016/j.sna.2019.04.025 .

Dunst, Paul, Peter Bornmann, Tobias Hemsel, Walter. Littmann, and Walter Sextro. “Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders.” ACTUATOR 2018; 16th International Conference on New Actuators, 2018, 142–45.

Dunst, Paul, Peter Bornmann, Tobias Hemsel, and Walter Sextro. “Vibration-Assisted Handling of Dry Fine Powders.”https://doi.org/10.3390/act7020018__Actuators 2018, 7(2)., 2018, 1–11.https://doi.org/10.3390/act7020018 .

Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 1–6, 2018.