Vibration-Assisted Handling of Dry Fine Powders
P. Dunst, P. Bornmann, T. Hemsel, W. Sextro, Actuators 2018, 7(2). (2018) 1–11.

Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.

Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.

Steigerung der Intelligenz mechatronischer Systeme
T. Meyer, T. Kaul, J.K. Kimotho, W. Sextro, Steigerung Der Intelligenz Mechatronischer Systeme, Springer Nature Switzerland AG. Part of Springer Nature., 2018.

Effects of different working frequencies on the joint formation in copper wire bonding
R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, in: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.

Numerical and experimental investigations in ultrasonic heavy wire bonding
R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.

Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.

Integrated modeling of behavior and reliability in system development
J. Hentze, T. Kaul, I. Gräßler, W. Sextro, in: A. Maier, S. Skec, C. McKesson, M. Van der Loos (Eds.), ICE, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN, Nr. DS 87-USB, Design Society, 2017, pp. 385–394.

Entwicklung eines Condition Monitoring Systems für Gummi-Metall-Elemente
A. Bender, T. Kaul, W. Sextro, in: Verlagsschriftenreihe Des Heinz Nixdorf Instituts Band 369, Paderborn, 2017, Wissenschaftsforum Intelligente Technische Systeme (WInTeSys) 2017, 2017, pp. 347–358.

Modellbasierte Prognose der nutzbaren Restlebensdauer von Gummi-Metall-Elementen
A. Bender, J.K. Kimotho, S. Kohl, W. Sextro, K. Reinke, in: 15. Internationale Schienenfahrzeugtagung, 2017, pp. 123–125.

Neuartiges Konzept zur Lebensdauerprognose von Gummi-Metall-Elementen
A. Bender, W. Sextro, K. Reinke, in: VDI-Berichte 2301, 2017, pp. 49–60.

Analysis of pipe vibration in an ultrasonic powder transportationsystem
P. Dunst, T. Hemsel, W. Sextro, Elsevier Sensors and Actuators A 263 (2017) 733–736.

Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).

Integrated modeling og behavior and reliability in system development
J. Hentze, T. Kaul, I. Grässler, W. Sextro, in: ICE, 21st International Conference on Enginieering Design, 2017, pp. 385–394.

Formulation of reliability-related objective functions for design of intelligent mechatronic systems
T. Kaul, T. Meyer, W. Sextro, SAGE Journals Vol. 231(4) (2017) 390–399.

Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing
J.K. Kimotho, W. Sextro, T. Hemsel, in: IEEE Transactions on Reliability, 2017, pp. 1–10.

MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall
R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.

Model based optimization of dynamics in adaptive headlamps
S. Schulze, W. Sextro, K. Kister, in: Proceedings of the 12th International Symposium on Automotive Lighting 2017, 2017.

Entwicklung verlässlicher, intelligenter Systeme
W. Sextro, T. Meyer, T. Kaul, J.K. Kimotho, in: VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung Und Betrieb Zuverlässiger Produkte., Leonberg, 2017, pp. 17–30.

Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.