@inproceedingsBender_Sextro_Reinke_2017, title=Neuartiges Konzept zur Lebensdauerprognose von Gummi-Metall-Elementen, booktitle=VDI-Berichte 2301, author=Bender, Amelie and Sextro, Walter and Reinke, Kai, year=2017, pages=49–60 

@articleDunst_Hemsel_Sextro_2017, title=Analysis of pipe vibration in an ultrasonic powder transportationsystem, volume=Sensors and Actuators A 263, journal=elsevier, author=Dunst, Paul and Hemsel, Tobias and Sextro, Walter, year=2017, pages=733–736 

@articleEichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017, title=Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design, volume=Vol. 2017, No. 1, journal=IMAPSource, author=Eichwald, Paul and Althoff, Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias, year=2017 

@inproceedingsHentze_Kaul_Grässler_Sextro_2017, title=Integrated modeling og behavior and reliability in system development, booktitle=ICE, 21st International conference on enginieering design, author=Hentze, Julian and Kaul, Thorben and Grässler, Iris and Sextro, Walter, year=2017, pages=385–394 

@articleKaul_Meyer_Sextro_2017, title=Formulation of reliability-related objective functions for design of intelligent mechatronic systems, volume=Vol. 231(4), DOI=10.1177/1748006X17709376, journal=SAGE Journals, author=Kaul, Thorben and Meyer, Tobias and Sextro, Walter, year=2017, pages=390–399 

@inproceedingsKimotho_Sextro_Hemsel_2017, title=Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing, DOI=10.1109/TR.2017.2710260, booktitle=IEEE Transactions on Reliability, author=Kimotho, James Kuria and Sextro, Walter and Hemsel, Tobias, year=2017, pages=1–10 

@inproceedingsSchemmel_Hemsel_Sextro_2017, place=Kiel 2017, title=MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall, booktitle=43. Deutsche Jahrestagung für Akustik, author=Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter, year=2017, pages=611–614 

@inproceedingsSchulze_Sextro_Kister_2017, title=Model based optimization of dynamics in adaptive headlamps, booktitle=Proceedings of the 12th International Symposium on Automotive Lighting 2017, author=Schulze, Sebastian and Sextro, Walter and Kister, K., year=2017 

@inproceedingsSextro_Meyer_Kaul_Kimotho_2017, place=Leonberg, title=Entwicklung verlässlicher, intelligenter Systeme, booktitle=VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung und Betrieb zuverlässiger Produkte., author=Sextro, Walter and Meyer, Tobias and Kaul, Thorben and Kimotho, James Kuria, year=2017, pages=17–30 

@inproceedingsAlthoff_Meyer_Unger_Sextro_Eacock_2016, title=Shape-Dependent Transmittable Tangential Force of Wire Bond Tools, DOI=10.1109/ECTC.2016.234, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian, year=2016, pages=2103–2110 

@articleBrökelmann_Unger_Meyer_Althoff_Sextro_Hunstig_Biermann_Guth_2016, title=Kupferbondverbindungen intelligent herstellen, volume=7/8, journal=wt-online, author=Brökelmann, Michael and Unger, Andreas and Meyer, Tobias and Althoff, Simon and Sextro, Walter and Hunstig, Matthias and Biermann, Florian and Guth, Karsten, year=2016, pages=512–519 

@inproceedingsDunst_Sextro_Bornmann_Hemsel_Littmann_2016, place=Braunschweig, title=Transportation of dry fine powders by coordinated friction manipulation, DOI=10.1002/pamm.201610306, booktitle=PAMM Proc. Appl. Math. Mech. 16, author=Dunst, Paul and Sextro, Walter and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter, year=2016, pages=635–636 

@inproceedingsEichwald_Unger_Eacock_Althoff_Sextro_Guth_Brökelmann_2016, title=Micro Wear Modeling in Copper Wire Wedge Bonding, booktitle=IEEE CPMT Symposium Japan, 2016, author=Eichwald, Paul and Unger, Andreas and Eacock, Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann, Michael, year=2016 

@inproceedingsKaul_Meyer_Sextro_2016, title=Modeling of Complex Redundancy in Technical Systems with Bayesian Networks, booktitle=Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016, author=Kaul, Thorben and Meyer, Tobias and Sextro, Walter, year=2016 

@inproceedingsKohl_Sextro_Schulze_2016, place=Cyberjaya, Malaysia, 2016, title=Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS, booktitle=The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., author=Kohl, Sergej and Sextro, Walter and Schulze, Sebastian, year=2016, pages=1–12 

@inproceedingsLessmeier_Kimotho_Zimmer_Sextro_2016, title=Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification, booktitle=European Conference of the Prognostics and Health Management Society, author=Lessmeier, Christian and Kimotho, James Kuria and Zimmer, Detmar and Sextro, Walter, year=2016 

@inproceedingsMeyer10.1109/ECTC.2016.215Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title=Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation, DOI=10.1109/ECTC.2016.215, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten, year=2016, pages=622–628 

@inproceedingsSchulze_Sextro_Kohl_2016, title=Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems, booktitle=2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, author=Schulze, Sebastian and Sextro, Walter and Kohl, Sergej, year=2016, pages=1–11 

@inproceedingsUnger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place=IEEE CPMT Symposium Japan, title=Validated Simulation of the Ultrasonic Wire Bonding Process, booktitle=Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, author=Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten, year=2016, pages=251–254 

@inproceedingsAlthoff_Unger_Sextro_Eacock_2015, title=Improving the cleaning process in copper wire bonding by adapting bonding parameters, DOI=10.1109/EPTC.2015.7412402, booktitle=2015 17th Electronics Packaging Technology Conference, author=Althoff, Simon and Unger, Andreas and Sextro, Walter and Eacock, Florian, year=2015, pages=1–6