Brökelmann M, Unger A, Meyer T, et al. Kupferbondverbindungen intelligent herstellen. wt-online. 2016;7/8:512-519.

Dunst P, Sextro W, Bornmann P, Hemsel T, Littmann W. Transportation of dry fine powders by coordinated friction manipulation. In: PAMM Proc. Appl. Math. Mech. 16. Braunschweig; 2016:635-636. doi:10.1002/pamm.201610306

Eichwald P, Unger A, Eacock F, et al. Micro Wear Modeling in Copper Wire Wedge Bonding. In: IEEE CPMT Symposium Japan, 2016. ; 2016.

Kaul T, Meyer T, Sextro W. Modeling of Complex Redundancy in Technical Systems with Bayesian Networks. In: Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016. ; 2016.

Kohl S, Sextro W, Schulze S. Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS. In: The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016. Cyberjaya, Malaysia, 2016; 2016:1-12.

Lessmeier C, Kimotho JK, Zimmer D, Sextro W. Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification. In: European Conference of the Prognostics and Health Management Society. ; 2016.

Meyer10.1109/ECTC.2016.215__T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215

Schulze S, Sextro W, Kohl S. Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems. In: 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016. ; 2016:1-11.

Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.

Althoff S, Unger A, Sextro W, Eacock F. Improving the cleaning process in copper wire bonding by adapting bonding parameters. In: 2015 17th Electronics Packaging Technology Conference. ; 2015:1-6. doi:10.1109/EPTC.2015.7412402

Bornmann P, Hemsel T, Sextro W, Memoli G, Hodnett M, Zeqiri B. Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler. tm - Technisches Messen. 2015;82(2):73-84. doi:10.1515/teme-2015-0017

Kaul T, Meyer T, Sextro W. Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme. In: Gausemeier J, Dumitrescu R, Rammig F, Schäfer W, Trächtler A, eds. 10. Paderborner Workshop Entwurf Mechatronischer Systeme. HNI-Verlagsschriftenreihe. Paderborn: Heinz Nixdorf Institut, Universität Paderborn; 2015:101-112.

Kaul T, Meyer T, Sextro W. Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems. In: et al. P, ed. European Safety and Reliability Conference (ESREL2015). London: Taylor and Francis; 2015. doi:10.1201/b19094-290

Kimotho JK, Sextro W. Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics. In: Annual Conference of the Prognostics and Health Management Society 2015. Vol 6. ; 2015.

Meyer T, Kaul T, Sextro W. Advantages of reliability-adaptive system operation for maintenance planning. In: Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes. ; 2015:940-945. doi:10.1016/j.ifacol.2015.09.647

Meyer T, Kimotho JK, Sextro W. Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme. In: 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte. Leonberg; 2015:111-122.

Meyer T, Unger A, Althoff S, et al. Modeling and simulation of the ultrasonic wire bonding process. In: 2015 17th Electronics Packaging Technology Conference. ; 2015. doi:10.1109/EPTC.2015.7412377

Schulte F, Neuhaus J, Sextro W. A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In: Proceedings of ICoEV 2015 International Conference on Engineering Vibration. ; 2015:1109-1117.

Unger A, Sextro W, Meyer T, et al. Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In: 2015 17th Electronics Packaging Technology Conference. ; 2015. doi:10.1109/EPTC.2015.7412375

Gausemeier J, Rammig F-J, Schäfer W, Sextro W. Dependability of Self-Optimizing Mechatronic Systems. Springer-Verlag; 2014.