M. Brökelmann et al., “Kupferbondverbindungen intelligent herstellen,” wt-online, vol. 7/8, pp. 512–519, 2016.

P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, and W. Littmann, “Transportation of dry fine powders by coordinated friction manipulation,” in PAMM Proc. Appl. Math. Mech. 16, 2016, pp. 635–636.

P. Eichwald et al., “Micro Wear Modeling in Copper Wire Wedge Bonding,” in IEEE CPMT Symposium Japan, 2016, 2016.

T. Kaul, T. Meyer, and W. Sextro, “Modeling of Complex Redundancy in Technical Systems with Bayesian Networks,” in Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016, 2016.

S. Kohl, W. Sextro, and S. Schulze, “Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS,” in The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., 2016, pp. 1–12.

C. Lessmeier, J. K. Kimotho, D. Zimmer, and W. Sextro, “Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification,” in European Conference of the Prognostics and Health Management Society, 2016.

T. Meyer  et al., “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.

S. Schulze, W. Sextro, and S. Kohl, “Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems,” in 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 2016, pp. 1–11.

A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–254.

S. Althoff, A. Unger, W. Sextro, and F. Eacock, “Improving the cleaning process in copper wire bonding by adapting bonding parameters,” in 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6.

P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, and B. Zeqiri, “Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler,” tm - Technisches Messen, vol. 82, no. 2, pp. 73–84, 2015.

T. Kaul, T. Meyer, and W. Sextro, “Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme,” in 10. Paderborner Workshop Entwurf mechatronischer Systeme, 2015, pp. 101–112.

T. Kaul, T. Meyer, and W. Sextro, “Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems,” in European Safety and Reliability Conference (ESREL2015), 2015.

J. K. Kimotho and W. Sextro, “Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics,” in Annual Conference of the Prognostics and Health Management Society 2015, 2015, vol. 6.

T. Meyer, T. Kaul, and W. Sextro, “Advantages of reliability-adaptive system operation for maintenance planning,” in Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes, 2015, pp. 940–945.

T. Meyer, J. K. Kimotho, and W. Sextro, “Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme,” in 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte, 2015, no. 2260, pp. 111–122.

T. Meyer et al., “Modeling and simulation of the ultrasonic wire bonding process,” in 2015 17th Electronics Packaging Technology Conference, 2015.

F. Schulte, J. Neuhaus, and W. Sextro, “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties,” in Proceedings of ICoEV 2015 International Conference on Engineering Vibration, 2015, pp. 1109–1117.

A. Unger et al., “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear,” in 2015 17th Electronics Packaging Technology Conference, 2015.

J. Gausemeier, F.-J. Rammig, W. Schäfer, and W. Sextro, Dependability of Self-Optimizing Mechatronic Systems.  Heidelberg, Germany: Springer-Verlag, 2014.