Neuartiges Konzept zur Lebensdauerprognose von Gummi-Metall-Elementen
A. Bender, W. Sextro, K. Reinke, in: VDI-Berichte 2301, 2017, pp. 49–60.

Analysis of pipe vibration in an ultrasonic powder transportationsystem
P. Dunst, T. Hemsel, W. Sextro, Elsevier Sensors and Actuators A 263 (2017) 733–736.

Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).

Integrated modeling og behavior and reliability in system development
J. Hentze, T. Kaul, I. Grässler, W. Sextro, in: ICE, 21st International Conference on Enginieering Design, 2017, pp. 385–394.

Formulation of reliability-related objective functions for design of intelligent mechatronic systems
T. Kaul, T. Meyer, W. Sextro, SAGE Journals Vol. 231(4) (2017) 390–399.

Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing
J.K. Kimotho, W. Sextro, T. Hemsel, in: IEEE Transactions on Reliability, 2017, pp. 1–10.

MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall
R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.

Model based optimization of dynamics in adaptive headlamps
S. Schulze, W. Sextro, K. Kister, in: Proceedings of the 12th International Symposium on Automotive Lighting 2017, 2017.

Entwicklung verlässlicher, intelligenter Systeme
W. Sextro, T. Meyer, T. Kaul, J.K. Kimotho, in: VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung Und Betrieb Zuverlässiger Produkte., Leonberg, 2017, pp. 17–30.

Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.

Kupferbondverbindungen intelligent herstellen
M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F. Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.

Transportation of dry fine powders by coordinated friction manipulation
P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, W. Littmann, in: PAMM Proc. Appl. Math. Mech. 16, Braunschweig, 2016, pp. 635–636.

Micro Wear Modeling in Copper Wire Wedge Bonding
P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann, in: IEEE CPMT Symposium Japan, 2016, 2016.

Modeling of Complex Redundancy in Technical Systems with Bayesian Networks
T. Kaul, T. Meyer, W. Sextro, in: Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016, 2016.

Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS
S. Kohl, W. Sextro, S. Schulze, in: The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., Cyberjaya, Malaysia, 2016, 2016, pp. 1–12.

Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification
C. Lessmeier, J.K. Kimotho, D. Zimmer, W. Sextro, in: European Conference of the Prognostics and Health Management Society, 2016.

Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.

Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems
S. Schulze, W. Sextro, S. Kohl, in: 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 2016, pp. 1–11.

Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.

Improving the cleaning process in copper wire bonding by adapting bonding parameters
S. Althoff, A. Unger, W. Sextro, F. Eacock, in: 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6.