Hoppe, C., Mitschker, F., Mai, L., Liedke, M. O., Arcos, T., Awakowicz, P., Devi, A., Attallah, A. G., Butterling, M., Wagner, A., &; Grundmeier, G. (2022). Influence of surface activation on the microporosity of PECVD and PEALD SiO            <sub>              x            </sub>            thin films on PDMS. Plasma Processes and Polymers, 19(4), Article 2100174.https://doi.org/10.1002/ppap.202100174 
LibreCat: /record/34648
DOI: 10.1002/ppap.202100174

Tripathi, T. S., Wilken, M., Hoppe, C., de los Arcos, T., Grundmeier, G., Devi, A., &; Karppinen, M. (2021). Atomic Layer Deposition of Copper Metal Films from Cu(acac)            <sub>2</sub>            and Hydroquinone Reductant. Advanced Engineering Materials, 23(10), Article 2100446.https://doi.org/10.1002/adem.202100446 
LibreCat: /record/34645
DOI: 10.1002/adem.202100446

Mai, L., Zanders, D., Subaf, E., Ciftyurek, E., Hoppe, C., Rogalla, D.,https://doi.org/10.1021/acsami.8b16443__Devi, A. (2019). Low-Temperature Plasma-Enhanced Atomic Layer Deposition of Tin(IV) Oxide from a Functionalized Alkyl Precursor: Fabrication and Evaluation of SnO2-Based Thin-Film Transistor Devices. ACS Applied Materials &; Interfaces, 3169–3180.https://doi.org/10.1021/acsami.8b16443 
LibreCat: /record/22833
DOI: 10.1021/acsami.8b16443

Gebhard, M., Mitschker, F., Hoppe, C., Aghaee, M., Rogalla, D., Creatore, M.,https://doi.org/10.1002/ppap.201700209__Devi, A. (2018). A combinatorial approach to enhance barrier properties of thin films on polymers: Seeding and capping of PECVD thin films by PEALD. Plasma Processes and Polymers.https://doi.org/10.1002/ppap.201700209 
LibreCat: /record/22839
DOI: 10.1002/ppap.201700209

Hoppe, C., Mitschker, F., Giner, I., de los Arcos, T., Awakowicz, P., &; Grundmeier, G. (2017). Influence of organic surface chemistry on the nucleation of plasma deposited SiOxfilms. Journal of Physics D: Applied Physics.https://doi.org/10.1088/1361-6463/aa69e5 
LibreCat: /record/22849
DOI: 10.1088/1361-6463/aa69e5

Hoppe, C., Ebbert, C., Grothe, R., Schmidt, H. C., Hordych, I., Homberg, W.,https://doi.org/10.1002/adem.201600085__Grundmeier, G. (2016). Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation. ADVANCED ENGINEERING MATERIALS, 18(8), 1371–1380.https://doi.org/10.1002/adem.201600085 
LibreCat: /record/20941
DOI: 10.1002/adem.201600085
WoS: 000382984300008

Hoppe, C., Ebbert, C., Voigt, M., Schmidt, H. C., Rodman, D., Homberg, W.,https://doi.org/10.1002/adem.201500501__Grundmeier, G. (2016). Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation. ADVANCED ENGINEERING MATERIALS, 18(6), 1066–1074.https://doi.org/10.1002/adem.201500501 
LibreCat: /record/20942
DOI: 10.1002/adem.201500501
WoS: 000378684200023

Hordych, I., Rodman, D., Nürnberger, F., Hoppe, C., Schmidt, H. C., Grundmeier, G.,https://doi.org/10.1002/srin.201600021__Maier, H. J. (2016). Effect of Pre-Rolling Heat Treatments on the Bond Strength of Cladded Galvanized Steels in a Cold Roll Bonding Process. Steel Research International, 1619–1626.https://doi.org/10.1002/srin.201600021 
LibreCat: /record/22854
DOI: 10.1002/srin.201600021

Schmidt, H. C., Homberg, W., Hoppe, C., Grundmeier, G., Hordych, I., &; Maier, H. J. (2016). Cold pressure welding by incremental rolling: Deformation zone analysis.https://doi.org/10.1063/1.4963507 
LibreCat: /record/22858
DOI: 10.1063/1.4963507