C. Hoppe et al., “Influence of surface activation on the microporosity of PECVD and PEALD SiO            <sub>              x            </sub>            thin films on PDMS,”10.1002/ppap.202100174__Plasma Processes and Polymers, vol. 19, no. 4, Art. no. 2100174, 2022, doi:10.1002/ppap.202100174 .

T. S. Tripathi et al., “Atomic Layer Deposition of Copper Metal Films from Cu(acac)            <sub>2</sub>            and Hydroquinone Reductant,”10.1002/adem.202100446__Advanced Engineering Materials, vol. 23, no. 10, Art. no. 2100446, 2021, doi:10.1002/adem.202100446 .

L. Mai et al., “Low-Temperature Plasma-Enhanced Atomic Layer Deposition of Tin(IV) Oxide from a Functionalized Alkyl Precursor: Fabrication and Evaluation of SnO2-Based Thin-Film Transistor Devices,” ACS Applied Materials &; Interfaces, pp. 3169–3180, 2019.

M. Gebhard et al., “A combinatorial approach to enhance barrier properties of thin films on polymers: Seeding and capping of PECVD thin films by PEALD,” Plasma Processes and Polymers, 2018.

C. Hoppe, F. Mitschker, I. Giner, T. de los Arcos, P. Awakowicz, and G. Grundmeier, “Influence of organic surface chemistry on the nucleation of plasma deposited SiOxfilms,” Journal of Physics D: Applied Physics, 2017.

C. Hoppe et al., “Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation,” ADVANCED ENGINEERING MATERIALS, vol. 18, no. 8, pp. 1371–1380, 2016.

C. Hoppe et al., “Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation,” ADVANCED ENGINEERING MATERIALS, vol. 18, no. 6, pp. 1066–1074, 2016.

I. Hordych et al., “Effect of Pre-Rolling Heat Treatments on the Bond Strength of Cladded Galvanized Steels in a Cold Roll Bonding Process,” steel research international, pp. 1619–1626, 2016.

H. C. Schmidt, W. Homberg, C. Hoppe, G. Grundmeier, I. Hordych, and H. J. Maier, “Cold pressure welding by incremental rolling: Deformation zone analysis,” 2016.