R. Schemmel, Enhanced process development by simulation of ultrasonic heavy wire bonding, vol. 13. Shaker, 2022.
LibreCat: /record/34272
DOI: 10.17619/UNIPB/1-1280

R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,”https://doi.org/10.1016/j.microrel.2021.114077__Microelectronics Reliability, vol. 119, p. 114077, 2021, doi:https://doi.org/10.1016/j.microrel.2021.114077 .
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077

R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
LibreCat: /record/17355

R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,”10.1109/eurosime48426.2020.9152679__2020, doi:10.1109/eurosime48426.2020.9152679 .
LibreCat: /record/17706
DOI: 10.1109/eurosime48426.2020.9152679

R. Schemmel et al., “Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding,”10.4071/2380-4505-2019.1.000509__in International Symposium on Microelectronics, Boston, 2019, pp. 509–514, doi:10.4071/2380-4505-2019.1.000509 .
LibreCat: /record/15412
DOI: 10.4071/2380-4505-2019.1.000509

R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,”10.1016/j.sna.2019.04.025__Sensors and Actuators A: Physical, vol. 295, pp. 653–662, 2019, doi:10.1016/j.sna.2019.04.025 .
LibreCat: /record/10334
DOI: 10.1016/j.sna.2019.04.025

C. Dymel et al., “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat: /record/9992

C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat: /record/9993

R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig, “Effects of different working frequencies on the joint formation in copper wire bonding,” in CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), 2018, pp. 230–235.
LibreCat: /record/9997

R. Schemmel, T. Hemsel, and W. Sextro, “Numerical and experimental investigations in ultrasonic heavy wire bonding,” in 6th European Conference on Computational Mechanics (ECCM 6), 2018, pp. 1–12.
LibreCat: /record/9998

P. Eichwald et al., “Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design,” IMAPSource, vol. Vol. 2017, No. 1, 2017.
LibreCat: /record/9973

R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall,” in 43. Deutsche Jahrestagung für Akustik, 2017, pp. 611–614.
LibreCat: /record/9982

A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–254.
LibreCat: /record/9968