Schemmel R. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Vol 13. Shaker; 2022. doi:10.17619/UNIPB/1-1280
LibreCat: /record/34272
DOI: 10.17619/UNIPB/1-1280

Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability. 2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077

Schemmel R, Scheidemann C, Hemsel T, Kirsch O, Sextro W. Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. In: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems. ; 2020:1-6.
LibreCat: /record/17355

Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). ; 2020. doi:10.1109/eurosime48426.2020.9152679
LibreCat: /record/17706
DOI: 10.1109/eurosime48426.2020.9152679

Schemmel R, Eacock F, Dymel C, et al. Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. In: International Symposium on Microelectronics. ; 2019:509-514. doi:10.4071/2380-4505-2019.1.000509
LibreCat: /record/15412
DOI: 10.4071/2380-4505-2019.1.000509

Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025
LibreCat: /record/10334
DOI: 10.1016/j.sna.2019.04.025

Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany). ; 2018:1-6.
LibreCat: /record/9992

Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan). ; 2018:41-44.
LibreCat: /record/9993

Schemmel R, Althoff S, Sextro W, Unger A, Brökelmann M, Hunstig M. Effects of different working frequencies on the joint formation in copper wire bonding. In: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018). Stuttgart, Germany; 2018:230-235.
LibreCat: /record/9997

Schemmel R, Hemsel T, Sextro W. Numerical and experimental investigations in ultrasonic heavy wire bonding. In: 6th European Conference on Computational Mechanics (ECCM 6). Glasgow, UK; 2018:1-12.
LibreCat: /record/9998

Eichwald P, Althoff S, Schemmel R, et al. Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. IMAPSource. 2017;Vol. 2017, No. 1.
LibreCat: /record/9973

Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In: 43. Deutsche Jahrestagung Für Akustik. Kiel 2017; 2017:611-614.
LibreCat: /record/9982

Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.
LibreCat: /record/9968