A Hybrid Data Generation Approach for the Development of an AI-based EMC Interference Recognition Method
S. Lange, M. Olbrich, D. Hemker, J. Maalouly, J. Kutter, D. Schröder, C. Hedayat, M. Kleinen, A. Grünwaldt, J. Bärenfänger, H. Mathis, H. Kuhn, in: 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, IEEE, Bruges, Belgium, 2024.

Evaluation of Simulated and Real Measurement Data for AI-based Interference Classification in EMC Applications
J. Maalouly, D. Hemker, S. Lange, M. Olbrich, C. Hedayat, J. Kutter, H. Mathis, in: 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, IEEE, Brugge, Belgium , 2024.

Enhancing Information Extraction in EMC Measurements through Artificial Intelligence
M. Stiemer, S. Lange, D. Schröder, C. Hedayat, J. Maalouly, D. Hemker, H. Mathis, in: 2024 Smart Systems Integration Conference and Exhibition (SSI), IEEE, Hamburg, 2024.

Using Autoencoders to Classify EMC Problems in Electronic System Development
J. Maalouly, D. Hemker, C. Hedayat, M. Olbrich, S. Lange, H. Mathis, Advances in Radio Science 22 (2024) 53–59.

Characterization of Various Environmental Influences on the Inductive Localization
S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, J. Förstner, in: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), IEEE, Genoa, Italy , 2023.

AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development
J. Maalouly, D. Hemker, C. Hedayat, C. Rückert, I. Kaufmann, M. Olbrich, S. Lange, H. Mathis, in: 2022 Kleinheubach Conference, IEEE, Miltenberg, Germany, 2022.

Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings
S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.

Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods
T. Sander, S. Lange, U. Hilleringmann, V. Geneiß, C. Hedayat, H. Kuhn, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.

Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method
C. Marschalt, D. Schroder, S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, D. Sievers, J. Förstner, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.

Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses
S. Lange, D. Schröder, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE,  Valencia, Spain , 2021.

Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction
T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, F.-B. Gockel, in: 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, Valencia, Spain , 2021.

Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field
S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2021.

Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the N
S. Lange, D. Schroder, C. Hedayat, C. Hangmann, T. Otto, U. Hilleringmann, in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, IEEE, 2020.

Far-field prediction combining simulations with near-field measurements for EMI assessment of PCBs
D. Schroder, S. Lange, C. Hangmann, C. Hedayat, in: Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis, 1st ed.,  The Institution of Engineering and Technology (IET), Croyton, UK, 2020, pp. 315-346 (32).

Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics
S. Lange, D. Schröder, C. Hedayat, T. Otto, U. Hilleringmann, in: 2019 17th IEEE International New Circuits and Systems Conference (NEWCAS), 2019.

Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission
S. Lange, M.-J. Büker, D. Sievers, C. Hedayat, J. Förstner, U. Hilleringmann, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, VDE VERLAG GMBH, Berlin · Offenbach, 2019, pp. 1–4.