Lange, S., Hilleringmann, U., Hedayat, C., Kuhn, H., &; Förstner, J. (2023). Characterization of Various Environmental Influences on the Inductive Localization. 2023 IEEE Conference on Antenna Measurements and Applications (CAMA). 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa, Italy .https://doi.org/10.1109/cama57522.2023.10352780 

Maalouly, J., Hemker, D., Hedayat, C., Rückert, C., Kaufmann, I., Olbrich, M., Lange, S., &; Mathis, H. (2022). AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development. 2022 Kleinheubach Conference. 2022 Kleinheubach Conference, Miltenberg, Germany.

Lange, S., Hedayat, C., Kuhn, H., &; Hilleringmann, U. (2022). Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. 2022 Smart Systems Integration (SSI). 2022 Smart Systems Integration (SSI), Grenoble, France.https://doi.org/10.1109/ssi56489.2022.9901416 

Sander, T., Lange, S., Hilleringmann, U., Geneiß, V., Hedayat, C., &; Kuhn, H. (2022). Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods. 2022 Smart Systems Integration (SSI). 2022 Smart Systems Integration (SSI), Grenoble, France.https://doi.org/10.1109/ssi56489.2022.9901433 

Marschalt, C., Schroder, D., Lange, S., Hilleringmann, U., Hedayat, C., Kuhn, H., Sievers, D., &; Förstner, J. (2022). Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method. 2022 Smart Systems Integration (SSI). 2022 Smart Systems Integration (SSI), Grenoble, France.https://doi.org/10.1109/ssi56489.2022.9901431 

Lange, S., Schröder, D., Hedayat, C., Kuhn, H., &; Hilleringmann, U. (2021). Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses. In 22nd IEEE International Conference on Industrial Technology (ICIT).https://doi.org/10.1109/icit46573.2021.9453609__Valencia, Spain : IEEE.https://doi.org/10.1109/icit46573.2021.9453609 

Sander, T., Lange, S., Hilleringmann, U., Geneis, V., Hedayat, C., Kuhn, H., &; Gockel, F.-B. (2021). Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction. In 22nd IEEE International Conference on Industrial Technology (ICIT). Valencia, Spain : IEEE.https://doi.org/10.1109/icit46573.2021.9453646 

Lange, S., Hedayat, C., Kuhn, H., &; Hilleringmann, U. (2021). Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field. In 2021 Smart Systems Integration (SSI). Grenoble, France: IEEE.https://doi.org/10.1109/ssi52265.2021.9466958 

Lange, S., Schroder, D., Hedayat, C., Hangmann, C., Otto, T., &; Hilleringmann, U. (2020). Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the N. In 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE. Rome, Italy : IEEE.https://doi.org/10.1109/emceurope48519.2020.9245697 

Schroder, D., Lange, S., Hangmann, C., &; Hedayat, C. (2020). Far-field prediction combining simulations with near-field measurements for EMI assessment of PCBs. In Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis (1st ed., pp. 315-346 (32)). Croyton, UK:https://doi.org/10.1049/pbcs072e_ch14__The Institution of Engineering and Technology (IET).https://doi.org/10.1049/pbcs072e_ch14 

Lange, S., Büker, M.-J., Sievers, D., Hedayat, C., Förstner, J., Hilleringmann, U., &; Otto, T. (2019). Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission. In Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems (pp. 1–4). Berlin · Offenbach: VDE VERLAG GMBH.

Lange, S., Schröder, D., Hedayat, C., Otto, T., &; Hilleringmann, U. (2019). Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics. In 2019 17th IEEE International New Circuits and Systems Conference (NEWCAS). Munich, Germany.https://doi.org/10.1109/newcas44328.2019.8961227