Lead-Free Ceramics in Prestressed Ultrasonic Transducers
C. Scheidemann, P. Bornmann, W. Littmann, T. Hemsel, Actuators 14 (2025).

Estimation of temperature-dependent piezoelectric material parameters using ring-shaped specimens
O. Friesen, L. Claes, C. Scheidemann, N. Feldmann, T. Hemsel, B. Henning, in: 2023 International Congress on Ultrasonics, Beijing, China, IOP Publishing, 2024, p. 012125.

The Influence of Ultrasonic Irradiation of a 316L Weld Pool Produced by DED on the Mechanical Properties of the Produced Component
D. Lehnert, C. Bödger, P. Pabel, C. Scheidemann, T. Hemsel, S. Gnaase, D. Kostka, T. Tröster, Crystals 14 (2024).

Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.

Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.

Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process
C. Scheidemann, O.E.C. Hagedorn, T. Hemsel, W. Sextro, in: 2023.

Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells
B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), 2023.

Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells
R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), 2023.

Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen
C. Scheidemann, T. Hemsel, W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen, LibreCat University, 2022.

Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding
C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.

Application and modelling of ultrasonic transducers using 1-3 piezoelectric composites with structured electrodes
D. Dreiling, D. Itner, N. Feldmann, C. Scheidemann, H. Gravenkamp, B. Henning, in: Fortschritte Der Akustik - DAGA 2021, Deutsche Gesellschaft für Akustik e.V. (DEGA), Wien, 2021.

Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.