B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), Dresden, 2023.
LibreCat: /record/47234

R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), Dresden, 2023.
LibreCat: /record/47235

C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea, 2023.
LibreCat: /record/51117

C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the International Conference on Functional Materials &; Devices 2023 (ICFMD 2023), Incheon, Korea, 2023.
LibreCat: /record/51118

C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” presented at the International Conference on Functional Materials &; Devices 2023 (ICFMD 2023), Jeju, Korea, 2023.
LibreCat: /record/51119

C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding,”10.1109/estc55720.2022.9939478__2022, doi:10.1109/estc55720.2022.9939478 .
LibreCat: /record/34104
DOI: 10.1109/estc55720.2022.9939478

C. Scheidemann, T. Hemsel, and W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022.
LibreCat: /record/52045
DOI: 10.2314/KXP:1879655276

D. Dreiling, D. Itner, N. Feldmann, C. Scheidemann, H. Gravenkamp, and B. Henning, “Application and modelling of ultrasonic transducers using 1-3 piezoelectric composites with structured electrodes,” presented at the DAGA 2021 - 47. JAHRESTAGUNG FÜR AKUSTIK, Wien, 2021.
LibreCat: /record/25265

R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
LibreCat: /record/17355