Sehlmeyer, Birte, Rebecca  Kampmann, Claus Scheidemann, Tobias Hemsel, and Mathias  Getzlaff. “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.

Kampmann, Rebecca, Birte Sehlmeyer, Claus Scheidemann, Tobias Hemsel, and Mathias Getzlaff. “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.

Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023.

Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023.

Scheidemann, Claus, Oliver Ernst Caspar Hagedorn, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” 2023.

Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.”https://doi.org/10.1109/estc55720.2022.9939478__In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE, 2022.https://doi.org/10.1109/estc55720.2022.9939478 .

Scheidemann, Claus, Tobias Hemsel, and Walter Sextro. Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022.https://doi.org/10.2314/KXP:1879655276 .

Dreiling, Dmitrij, Dominik Itner, Nadine Feldmann, Claus Scheidemann, Hauke Gravenkamp, and Bernd Henning. “Application and Modelling of Ultrasonic Transducers Using 1-3 Piezoelectric Composites with Structured Electrodes.” In Fortschritte Der Akustik - DAGA 2021. Wien: Deutsche Gesellschaft für Akustik e.V. (DEGA), 2021.

Schemmel, Reinhard, Claus Scheidemann, Tobias Hemsel, Olaf  Kirsch, and Walter Sextro. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic Heavy Wire Bonding.” In CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6, 2020.