C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” presented at the International Conference on Functional Materials &; Devices 2023 (ICFMD 2023), Jeju, Korea, 2023.

O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding,” in CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, Berlin, 2022, pp. 138–143.

O. E. C. Hagedorn, D. Pielsticker, T. Hemsel, and W. Sextro, “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen,” in 2. VDI-Fachtagung Schwingungen 2019, 2019.