@articleSchemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title=Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding, volume=295, DOI=10.1016/j.sna.2019.04.025, journal=Sensors and Actuators A: Physical, author=Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter, year=2019, pages=653–662 

@inproceedingsDymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title=Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process, booktitle=(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), author=Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter, year=2018, pages=1–6 

@inproceedingsDymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title=Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding, booktitle=(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), author=Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias, year=2018, pages=41–44