Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Shaker, 2022, doi:10.17619/UNIPB/1-1280.
LibreCat: /record/34272
DOI: 10.17619/UNIPB/1-1280

Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”https://doi.org/10.1016/j.microrel.2021.114077__Microelectronics Reliability, vol. 119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077

Schemmel, Reinhard, et al. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic Heavy Wire Bonding.” CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
LibreCat: /record/17355

Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”10.1109/eurosime48426.2020.9152679__2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, doi:10.1109/eurosime48426.2020.9152679.
LibreCat: /record/17706
DOI: 10.1109/eurosime48426.2020.9152679

Schemmel, Reinhard, et al. “Impact of Multi-Dimensional Vibration Trajectories on Quality and Failure Modes in Ultrasonic Bonding.”10.4071/2380-4505-2019.1.000509__International Symposium on Microelectronics, 2019, pp. 509–14, doi:10.4071/2380-4505-2019.1.000509.
LibreCat: /record/15412
DOI: 10.4071/2380-4505-2019.1.000509

Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.”10.1016/j.sna.2019.04.025__Sensors and Actuators A: Physical, vol. 295, 2019, pp. 653–62, doi:10.1016/j.sna.2019.04.025.
LibreCat: /record/10334
DOI: 10.1016/j.sna.2019.04.025

Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat: /record/9992

Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat: /record/9993

Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), 2018, pp. 230–35.
LibreCat: /record/9997

Schemmel, Reinhard, et al. “Numerical and Experimental Investigations in Ultrasonic Heavy Wire Bonding.” 6th European Conference on Computational Mechanics (ECCM 6), 2018, pp. 1–12.
LibreCat: /record/9998

Eichwald, Paul, et al. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” IMAPSource, vol. Vol. 2017, No. 1, 2017.
LibreCat: /record/9973

Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” 43. Deutsche Jahrestagung Für Akustik, 2017, pp. 611–14.
LibreCat: /record/9982

Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–54.
LibreCat: /record/9968