@bookSchemmel_2022, series=Schriften des Lehrstuhls für Dynamik und Mechatronik, title=Enhanced process development by simulation of ultrasonic heavy wire bonding, volume=13, DOI=10.17619/UNIPB/1-1280, publisher=Shaker, author=Schemmel, Reinhard, year=2022, collection=Schriften des Lehrstuhls für Dynamik und Mechatronik 

@articleSchemmel_Krieger_Hemsel_Sextro_2021, title=Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization, volume=119, DOI=https://doi.org/10.1016/j.microrel.2021.114077, journal=Microelectronics Reliability, author=Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter, year=2021, pages=114077 

@inproceedingsSchemmel_Scheidemann_Hemsel_Kirsch_Sextro_2020, title=Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding, booktitle=CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, author=Schemmel, Reinhard and Scheidemann, Claus and Hemsel, Tobias and Kirsch, Olaf  and Sextro, Walter, year=2020, pages=1–6 

@inproceedingsSchemmel_Krieger_Hemsel_Sextro_2020, title=Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization, DOI=10.1109/eurosime48426.2020.9152679, booktitle=2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), author=Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter, year=2020 

@inproceedingsSchemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019, title=Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding, DOI=10.4071/2380-4505-2019.1.000509, booktitle=International Symposium on Microelectronics, author=Schemmel, Reinhard and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter, year=2019, pages=509–514 

@articleSchemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title=Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding, volume=295, DOI=10.1016/j.sna.2019.04.025, journal=Sensors and Actuators A: Physical, author=Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter, year=2019, pages=653–662 

@inproceedingsDymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title=Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process, booktitle=(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), author=Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter, year=2018, pages=1–6 

@inproceedingsDymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title=Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding, booktitle=(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), author=Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias, year=2018, pages=41–44 

@inproceedingsSchemmel_Althoff_Sextro_Unger_Brökelmann_Hunstig_2018, place=Stuttgart, Germany, title=Effects of different working frequencies on the joint formation in copper wire bonding, booktitle=CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), author=Schemmel, Reinhard and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias, year=2018, pages=230–235 

@inproceedingsSchemmel_Hemsel_Sextro_2018, place=Glasgow, UK, title=Numerical and experimental investigations in ultrasonic heavy wire bonding, booktitle=6th European Conference on Computational Mechanics (ECCM 6), author=Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter, year=2018, pages=1–12 

@articleEichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017, title=Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design, volume=Vol. 2017, No. 1, journal=IMAPSource, author=Eichwald, Paul and Althoff, Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias, year=2017 

@inproceedingsSchemmel_Hemsel_Sextro_2017, place=Kiel 2017, title=MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall, booktitle=43. Deutsche Jahrestagung für Akustik, author=Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter, year=2017, pages=611–614 

@inproceedingsUnger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place=IEEE CPMT Symposium Japan, title=Validated Simulation of the Ultrasonic Wire Bonding Process, booktitle=Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, author=Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten, year=2016, pages=251–254