Althoff, S. (2023). Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach (Vol. 15). Shaker.
LibreCat: /record/41971

Sehlmeyer, B., Kampmann, R., Scheidemann, C., Hemsel, T., &; Getzlaff, M. (2023). Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM).
LibreCat: /record/47234

Kampmann, R., Sehlmeyer, B., Scheidemann, C., Hemsel, T., &; Getzlaff, M. (2023). Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM).
LibreCat: /record/47235

Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., &; Sextro, W. (2023). Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea.
LibreCat: /record/51117

Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., &; Sextro, W. (2023). Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. International Conference on Functional Materials &; Devices 2023 (ICFMD 2023), Incheon, Korea.
LibreCat: /record/51118

Scheidemann, C., Hagedorn, O. E. C., Hemsel, T., &; Sextro, W. (2023). Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. International Conference on Functional Materials &; Devices 2023 (ICFMD 2023), Jeju, Korea.
LibreCat: /record/51119

Schemmel, R. (2022). Enhanced process development by simulation of ultrasonic heavy wire bonding (Vol. 13). Shaker.https://doi.org/10.17619/UNIPB/1-1280 
LibreCat: /record/34272
DOI: 10.17619/UNIPB/1-1280

Hagedorn, O. E. C., Broll, M., Kirsch, O., Hemsel, T., &; Sextro, W. (2022). Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–143.
LibreCat: /record/30371

Scheidemann, C., Kirsch, O., Hemsel, T., &; Sextro, W. (2022). Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).https://doi.org/10.1109/estc55720.2022.9939478 
LibreCat: /record/34104
DOI: 10.1109/estc55720.2022.9939478

Scheidemann, C., Hemsel, T., &; Sextro, W. (2022). Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University.https://doi.org/10.2314/KXP:1879655276 
LibreCat: /record/52045
DOI: 10.2314/KXP:1879655276

Eichwald, P. (2021). Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens (Vol. 11). Shaker.
LibreCat: /record/34274

Dreiling, D., Itner, D., Feldmann, N., Scheidemann, C., Gravenkamp, H., &; Henning, B. (2021). Application and modelling of ultrasonic transducers using 1-3 piezoelectric composites with structured electrodes. Fortschritte Der Akustik - DAGA 2021. DAGA 2021 - 47. JAHRESTAGUNG FÜR AKUSTIK, Wien.
LibreCat: /record/25265

Schemmel, R., Krieger, V., Hemsel, T., &; Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077.https://doi.org/10.1016/j.microrel.2021.114077 
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077

Schemmel, R., Scheidemann, C., Hemsel, T., Kirsch, O., &; Sextro, W. (2020). Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6.
LibreCat: /record/17355

Schemmel, R., Krieger, V., Hemsel, T., &; Sextro, W. (2020). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).https://doi.org/10.1109/eurosime48426.2020.9152679 
LibreCat: /record/17706
DOI: 10.1109/eurosime48426.2020.9152679

Hagedorn, O. E. C., Pielsticker, D., Hemsel, T., &; Sextro, W. (2019). Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen. In 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019.
LibreCat: /record/15244

Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M., &; Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. International Symposium on Microelectronics, 509–514.https://doi.org/10.4071/2380-4505-2019.1.000509 
LibreCat: /record/15412
DOI: 10.4071/2380-4505-2019.1.000509

Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &; Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical, 295, 653–662.https://doi.org/10.1016/j.sna.2019.04.025 
LibreCat: /record/10334
DOI: 10.1016/j.sna.2019.04.025

Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).
LibreCat: /record/9992

Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., &; Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
LibreCat: /record/9993