Althoff S. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol 15. Shaker; 2023.

Sehlmeyer B, Kampmann R, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells. In: Deutsche Physikalische Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM). ; 2023.

Kampmann R, Sehlmeyer B, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells. In: Deutsche Physikalische Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM). ; 2023.

Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. In: ; 2023.

Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. In: ; 2023.

Scheidemann C, Hagedorn OEC, Hemsel T, Sextro W. Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. In: ; 2023.

Schemmel R. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Vol 13. Shaker; 2022. doi:10.17619/UNIPB/1-1280

Hagedorn OEC, Broll M, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. In: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems. VDE VERLAG GMBH; 2022:138-143.

Scheidemann C, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE; 2022. doi:10.1109/estc55720.2022.9939478

Scheidemann C, Hemsel T, Sextro W. Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University; 2022. doi:10.2314/KXP:1879655276

Eichwald P. Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens. Vol 11. Shaker; 2021.

Dreiling D, Itner D, Feldmann N, Scheidemann C, Gravenkamp H, Henning B. Application and modelling of ultrasonic transducers using 1-3 piezoelectric composites with structured electrodes. In: Fortschritte Der Akustik - DAGA 2021. Deutsche Gesellschaft für Akustik e.V. (DEGA); 2021.

Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability. 2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077

Schemmel R, Scheidemann C, Hemsel T, Kirsch O, Sextro W. Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. In: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems. ; 2020:1-6.

Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). ; 2020. doi:10.1109/eurosime48426.2020.9152679

Hagedorn OEC, Pielsticker D, Hemsel T, Sextro W. Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen. In: 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019; 2019.

Schemmel R, Eacock F, Dymel C, et al. Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. In: International Symposium on Microelectronics. ; 2019:509-514. doi:10.4071/2380-4505-2019.1.000509

Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025

Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany). ; 2018:1-6.

Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan). ; 2018:41-44.