Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2023.

Sehlmeyer, Birte, Rebecca  Kampmann, Claus Scheidemann, Tobias Hemsel, and Mathias  Getzlaff. “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.

Kampmann, Rebecca, Birte Sehlmeyer, Claus Scheidemann, Tobias Hemsel, and Mathias Getzlaff. “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.

Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023.

Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023.

Scheidemann, Claus, Oliver Ernst Caspar Hagedorn, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” 2023.

Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Vol. 13. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2022.https://doi.org/10.17619/UNIPB/1-1280 .

Hagedorn, Oliver Ernst Caspar, Marian Broll, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” In CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–43. Berlin: VDE VERLAG GMBH, 2022.

Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.”https://doi.org/10.1109/estc55720.2022.9939478__In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE, 2022.https://doi.org/10.1109/estc55720.2022.9939478 .

Scheidemann, Claus, Tobias Hemsel, and Walter Sextro. Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022.https://doi.org/10.2314/KXP:1879655276 .

Eichwald, Paul. Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens. Vol. 11. Schriften des Lehrstuhls für Dynamik und Mechatronik. Shaker, 2021.

Dreiling, Dmitrij, Dominik Itner, Nadine Feldmann, Claus Scheidemann, Hauke Gravenkamp, and Bernd Henning. “Application and Modelling of Ultrasonic Transducers Using 1-3 Piezoelectric Composites with Structured Electrodes.” In Fortschritte Der Akustik - DAGA 2021. Wien: Deutsche Gesellschaft für Akustik e.V. (DEGA), 2021.

Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”https://doi.org/10.1016/j.microrel.2021.114077__Microelectronics Reliability 119 (2021): 114077.https://doi.org/10.1016/j.microrel.2021.114077 .

Schemmel, Reinhard, Claus Scheidemann, Tobias Hemsel, Olaf  Kirsch, and Walter Sextro. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic Heavy Wire Bonding.” In CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6, 2020.

Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”https://doi.org/10.1109/eurosime48426.2020.9152679__In 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020.https://doi.org/10.1109/eurosime48426.2020.9152679 .

Hagedorn, Oliver Ernst Caspar, Daniel Pielsticker, Tobias Hemsel, and Walter Sextro. “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen.” In 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019, 2019.

Schemmel, Reinhard, Florian Eacock, Collin Dymel, Tobias Hemsel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Impact of Multi-Dimensional Vibration Trajectories on Quality and Failure Modes in Ultrasonic Bonding.”https://doi.org/10.4071/2380-4505-2019.1.000509__In International Symposium on Microelectronics, 509–14, 2019.https://doi.org/10.4071/2380-4505-2019.1.000509 .

Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.”https://doi.org/10.1016/j.sna.2019.04.025__Sensors and Actuators A: Physical 295 (2019): 653–62.https://doi.org/10.1016/j.sna.2019.04.025 .

Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 1–6, 2018.

Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44, 2018.