Vidor F, Meyers T, Hilleringmann U. Inverter Circuits Using ZnO Nanoparticle Based Thin-Film Transistors for Flexible Electronic Applications. Nanomaterials. 2016;6(9). doi:10.3390/nano6090154
LibreCat: /record/39467
DOI: 10.3390/nano6090154

Romero A, Gonzalez J, Hilleringmann U, Gloesekoetter P. Organic Field-Effect and Nanoparticle Thin-Film Transistors: Static Model. In: ANALOG 2016; 15. ITG/GMM-Symposium. ; 2016:1-6.
LibreCat: /record/39476

Vidor FF, Meyers T, Hilleringmann U, Wirth GI. Influence of UV irradiation and humidity on a low-cost ZnO nanoparticle TFT for flexible electronics. In: 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO). IEEE; 2016. doi:10.1109/nano.2015.7388836
LibreCat: /record/39480
DOI: 10.1109/nano.2015.7388836

Hangmann C, Mager T, Khan S, Hedayat C, Hilleringmann U. Improved rf design using precise 3d near-field measurements and near-field to far-field transformations. In: Smart System Integration-International Conference and Exhibition on Integration Issues of Miniaturized Systems. ; 2016.
LibreCat: /record/39478

Hett T, Krämmer S, Hilleringmann U, Kalt H, Zrenner A. High-Q whispering gallery microdisk resonators based on silicon oxynitride. Journal of Luminescence. 2016;191:131-134. doi:10.1016/j.jlumin.2016.11.016
LibreCat: /record/39456
DOI: 10.1016/j.jlumin.2016.11.016

Vidor F, Meyers T, Hilleringmann U. Flexible Electronics: Integration Processes for Organic and Inorganic Semiconductor-Based Thin-Film Transistors. Electronics. 2015;4(3):480-506. doi:10.3390/electronics4030480
LibreCat: /record/39479
DOI: 10.3390/electronics4030480

Wolff K, Hilleringmann U. Silicon Nanoparticles contacted by metal nanogaps for FET applications. In: ; 2015.
LibreCat: /record/39571

Hilleringmann U, Assion F, Vidor FF, Wirth GI. Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology. Journal of Machine to Machine Communications. 2015;1(3):197-214. doi:10.13052/jmmc2246-137x.131
LibreCat: /record/39495
DOI: 10.13052/jmmc2246-137x.131

Hilleringmann U, Vidor FF, Assion F. Application of side-wall deposition and etch-back technology for nanometer scale device integration. In: Proceedings of the 2nd Pan African International Conference on Science, Computing and Telecommunications (PACT 2014). IEEE; 2015. doi:10.1109/scat.2014.7055128
LibreCat: /record/39492
DOI: 10.1109/scat.2014.7055128

Hangmann C, Hedayat C, Hilleringmann U. Extended event-driven modeling of a :3-fractional-N PLL including non-ideal effects. In: 2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS). IEEE; 2015. doi:10.1109/icecs.2014.7049931
LibreCat: /record/39490
DOI: 10.1109/icecs.2014.7049931

Hangmann C, Hedayat C, Hilleringmann U. Fast and accurate event-driven simulation of a mixed-signal system using the example of a PLL. In: Proc. Int. Conf. Exhib. Integr. Issues Miniatured Syst. ; 2015.
LibreCat: /record/39482

Vidor FF, Wirth GI, Hilleringmann U. Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics. Microelectronics Reliability. 2014;54(12):2760-2765. doi:10.1016/j.microrel.2014.07.147
LibreCat: /record/39483
DOI: 10.1016/j.microrel.2014.07.147

Hangmann C, Hedayat C, Hilleringmann U. Stability Analysis of a Charge Pump Phase-Locked Loop Using Autonomous Difference Equations. IEEE Transactions on Circuits and Systems I: Regular Papers. 2014;61(9):2569-2577. doi:10.1109/tcsi.2014.2333331
LibreCat: /record/39484
DOI: 10.1109/tcsi.2014.2333331

Assion F, Geneiß V, Schönhoff M, Hedayat C, Hilleringmann U. Anodized Aluminum as Effective and Cheap Alternative Substrate for Thermoelectric Generators. In: Amaldi A, Tang F, eds. Proceedings of the 11th European Conference on Thermoelectrics. Springer International Publishing; 2014:83–88.
LibreCat: /record/39497

Schönhoff M, Assion F, Hilleringmann U. A Flexible Measurement System for the Characterization of Thermoelectric Materials. In: Amaldi A, Tang F, eds. Proceedings of the 11th European Conference on Thermoelectrics. Springer International Publishing; 2014:53–60.
LibreCat: /record/39498

Hilleringmann U, Kleine A. Replacing TCO electrodes in dye sensitized solar cells by metal grids. In: du Plessis M, ed. SPIE Proceedings. SPIE; 2014. doi:10.1117/12.2063218
LibreCat: /record/39500
DOI: 10.1117/12.2063218

Hilleringmann U. Lithografie. In: Silizium-Halbleitertechnologie. Springer Fachmedien Wiesbaden; 2014. doi:10.1007/978-3-8348-2085-3_4
LibreCat: /record/39501
DOI: 10.1007/978-3-8348-2085-3_4

Vidor F, Wirth G, Hilleringmann U. Random telegraph signal in nanoparticulated ZnO thin-film transistors. In: The 40th International Conference on Micro and Nano Engineering (MN14). ; 2014.
LibreCat: /record/39503

Kanwar K, Mager T, Hilleringmann U, Geneiss V, Hedayat C. Embedded UHF RFID tag design process for rubber transmission belt using 3D model. In: 2014 IEEE RFID Technology and Applications Conference (RFID-TA). IEEE; 2014. doi:10.1109/rfid-ta.2014.6934208
LibreCat: /record/39494
DOI: 10.1109/rfid-ta.2014.6934208

Hangmann C, Wullner I, Hedayat C, Hilleringmann U. Modeling and characterization of CP-PLL phase noise in presence of dead zone. In: 2014 IEEE 12th International New Circuits and Systems Conference (NEWCAS). IEEE; 2014. doi:10.1109/newcas.2014.6934054
LibreCat: /record/39486
DOI: 10.1109/newcas.2014.6934054