From Goals to Systems via Technical Requirements and Physical Models - Design of an Intelligent Cash Handling System
C. Lankeit, M. Lochbichler, F. Oestersötebier, A. Trächtler, M. Landwehr, in: Proceedings, IEEE, 2015.

Real-Time Compatible Phenomenological Modelling of the Austenitic Phase in Shape Memory Alloys as an Example for Modelling of Materials with Repeatable Non-Linear Characteristics
A. Pai, A. Trächtler, M. Schaper, in: IFAC 1st Conference on Modelling, Identification and Control of Nonlinear Systems - MICNON, 2015.

Towards a sustainable and economic selection of part candidates for Additive Manufacturing
C. Lindemann, U. Jahnke, T. Reiher, R. Koch, in: Rapid Prototyping Journal, Emerald, 2015, pp. 216–227.

Developement of an economic decision support for the application of Additive Manufacturing in aerospace
G. Deppe, C. Lindemann, R. Koch, in: 26th Annual International Solid Freeform Fabrication Symposium, 2015, pp. 1560–1563.

Protection measures against product piracy and application by the use of AM
U. Jahnke, J. Büsching, T. Reiher, R. Koch, in: 26th Annual International Solid Freeform Fabrication Symposium, 2015, pp. 1601–1611.

FE-Optimization and data handling for Additive Manufacturing of structural parts
T. Reiher, R. Koch, in: 26th Annual International Solid Freeform Fabrication Symposium, 2015, pp. 1092–1103.

Sustainable Part Selection for the Use of Additive Manufacturing in Companies Focussing on Prevention of Product Piracy
U. Jahnke, C. Lindemann, in: Inside 3D Printing Conference and Expo, 2015.

Exploring the cost and lifetime benefits of a topology optimized aerospace part applying additive manufacturing
G. Deppe, T. Reiher, R. Koch, in: International Conference Production Engineering and Management 2015, 2015, pp. 219–230.

Guidelines for a sustainable and economic selection of part candidates for space applications using additive manufacturing
C. Lindemann, T. Reiher, R. Koch, in: Paris Space Week, 2015.

Analysis and Optimization of the Dimensional Accuracy for FDM Parts manufactured with ABS-M30
F. Knoop, V. Schöppner, in: ASPE Spring Topical Meeting, 2015, pp. 26–31.

Mechanical and Thermal Properties of FDM Parts manufactured with Polyamide 12
F. Knoop, V. Schöppner, in: 26th Annual International Solid Freeform Fabrication Symposium, 2015, pp. 935–948.

Improving the cleaning process in copper wire bonding by adapting bonding parameters
S. Althoff, A. Unger, W. Sextro, F. Eacock, in: 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6.

Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler
P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, B. Zeqiri, Tm - Technisches Messen 82 (2015) 73–84.

Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme
T. Kaul, T. Meyer, W. Sextro, in: J. Gausemeier, R. Dumitrescu, F. Rammig, W. Schäfer, A. Trächtler (Eds.), 10. Paderborner Workshop Entwurf Mechatronischer Systeme, Heinz Nixdorf Institut, Universität Paderborn, Paderborn, 2015, pp. 101–112.

Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems
T. Kaul, T. Meyer, W. Sextro, in: P. et al. (Ed.), European Safety and Reliability Conference (ESREL2015), Taylor and Francis, London, 2015.

Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics
J.K. Kimotho, W. Sextro, in: Annual Conference of the Prognostics and Health Management Society 2015, 2015.

Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method
R. Kudo, P. Bornmann, T. Hemsel, T. Morita, Acoustical Science and Technology 36 (2015) 262–264.

Advantages of reliability-adaptive system operation for maintenance planning
T. Meyer, T. Kaul, W. Sextro, in: Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes, 2015, pp. 940–945.

Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme
T. Meyer, J.K. Kimotho, W. Sextro, in: 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte, Leonberg, 2015, pp. 111–122.

Modeling and simulation of the ultrasonic wire bonding process
T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015.