Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”10.1109/eurosime48426.2020.9152679__2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, doi:10.1109/eurosime48426.2020.9152679.
LibreCat: /record/17706
DOI: 10.1109/eurosime48426.2020.9152679