Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.

CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation
L.M. Witschen, T. Wiersema, H. Ghasemzadeh Mohammadi, M. Awais, M. Platzner, Microelectronics Reliability 99 (2019) 277–290.

Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics
F.F. Vidor, G.I. Wirth, U. Hilleringmann, Microelectronics Reliability 54 (2014) 2760–2765.