Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077

CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation
L.M. Witschen, T. Wiersema, H. Ghasemzadeh Mohammadi, M. Awais, M. Platzner, Microelectronics Reliability 99 (2019) 277–290.
LibreCat: /record/3585
DOI: 10.1016/j.microrel.2019.04.003

Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics
F.F. Vidor, G.I. Wirth, U. Hilleringmann, Microelectronics Reliability 54 (2014) 2760–2765.
LibreCat: /record/39483
DOI: 10.1016/j.microrel.2014.07.147