Hilleringmann U, Assion F, Vidor FF, Wirth GI. Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology. Journal of Machine to Machine Communications. 2015;1(3):197-214. doi:10.13052/jmmc2246-137x.131
LibreCat: /record/39495
DOI: 10.13052/jmmc2246-137x.131