@articleHilleringmann_Assion_Vidor_Wirth_2015, title=Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology, volume=1, DOI=10.13052/jmmc2246-137x.131, number=3, journal=Journal of Machine to Machine Communications, publisher=River Publishers, author=Hilleringmann, Ulrich and Assion, F. and Vidor, F. F. and Wirth, G. I., year=2015, pages=197–214 
LibreCat: /record/39495
DOI: 10.13052/jmmc2246-137x.131