Hilleringmann, Ulrich, et al. “Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology.”10.13052/jmmc2246-137x.131__Journal of Machine to Machine Communications, vol. 1, no. 3, River Publishers, 2015, pp. 197–214, doi:10.13052/jmmc2246-137x.131.
LibreCat: /record/39495
DOI: 10.13052/jmmc2246-137x.131