Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M., &; Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. International Symposium on Microelectronics, 509–514.https://doi.org/10.4071/2380-4505-2019.1.000509 
LibreCat: /record/15412
DOI: 10.4071/2380-4505-2019.1.000509