@inproceedingsSchemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019, title=Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding, DOI=10.4071/2380-4505-2019.1.000509, booktitle=International Symposium on Microelectronics, author=Schemmel, Reinhard and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter, year=2019, pages=509–514 
LibreCat: /record/15412
DOI: 10.4071/2380-4505-2019.1.000509