@articleSchemmel_Krieger_Hemsel_Sextro_2021, title=Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization, volume=119, DOI=https://doi.org/10.1016/j.microrel.2021.114077, journal=Microelectronics Reliability, author=Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter, year=2021, pages=114077 
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077