Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”https://doi.org/10.1016/j.microrel.2021.114077__Microelectronics Reliability 119 (2021): 114077.https://doi.org/10.1016/j.microrel.2021.114077 .
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077