Correlation between interlaminar shear strength of CFRP and joint strength of aluminium-CFRP hybrid joints
S. Wu, A. Delp, J. Freund, F. Walther, J. Haubrich, M. Löbbecke, T. Tröster, The Journal of Adhesion (2025) 1–26.

Mechanical properties and joinability of the near-eutectic aluminium casting alloy AlSi12
M. Neuser, P.K. Holtkamp, K.-P. Hoyer, F. Kappe, S. Yildiz, M. Bobbert, G. Meschut, M. Schaper, The Journal of Materials: Design and Applications, Part L (2025).

Mechanical joinability of microstructurally graded structural components manufactured from hypoeutectic aluminium casting alloys
M. Neuser, M.C. Schlichter, K.-P. Hoyer, M. Bobbert, G. Meschut, M. Schaper, 44th Conference of the International Deep Drawing Research Group (IDDRG 2025) 408 (2025).

Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.

Analysis of temperature effect on strength and microstructure in friction induced recycling process (FIRP)
T. Borgert, W. Homberg, in: Materials Research Proceedings, Materials Research Forum LLC, 2023.

Proof of concept for incremental sheet metal forming by means of electromagnetic and electrohydraulic high-speed forming
M. Holzmüller, M. Linnemann, W. Homberg, V. Psyk, V. Kräusel, J. Kroos, in: Materials Research Proceedings, Materials Research Forum LLC, 2023, pp. 11–18.

Assessment of AlZnMgCu alloy powder modification for crack-free laser powder bed fusion by differential fast scanning calorimetry
E. Zhuravlev, B. Milkereit, B. Yang, S. Heiland, P. Vieth, M. Voigt, M. Schaper, G. Grundmeier, C. Schick, O. Kessler, Materials &; Design (2021).

Festigkeitssteigerung von Aluminiumblechformteilen der 5000-Serie durch Erweiterung der Formgebungsgrenzen stark kaltverfestigter Ausgangswerkstoffe
A.A. Camberg, Festigkeitssteigerung von Aluminiumblechformteilen der 5000-Serie durch Erweiterung der Formgebungsgrenzen stark kaltverfestigter Ausgangswerkstoffe, Shaker Verlag, 2021.

Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.

Improvement of a rivet geometry for the self-piercing riveting of high-strength steel and multi-material joints
B. Uhe, C.-M. Kuball, M. Merklein, G. Meschut, Production Engineering 14 (2020) 417–423.

Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.

Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility
T. Rösener, A. Hoffmann, S. Herres-Pawlis, European Journal of Inorganic Chemistry 2018 (2018) 3164–3175.

Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer
A. Oppermann, L. Laurini, F. Etscheidt, K. Hollmann, F. Strassl, A. Hoffmann, D. Schurr, R. Dittmeyer, G. Rinke, S. Herres-Pawlis, Chemical Engineering \'26; Technology 40 (2017) 1475–1483.

Effect of different oxide layers on the ultrasonic copper wire bond process
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.

Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.

Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.

Microstructural investigations of aluminum and copper wire bonds
F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach, C. Zinn,  Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014.

Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding
P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.

Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.

Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]
S. Herres-Pawlis, G. Berth, V. Wiedemeier, L. Schmidt, A. Zrenner, H.-J. Warnecke, Journal of Luminescence 130 (2010) 1958–1962.