@bookAlthoff_2023, series=Schriften des Lehrstuhls für Dynamik und Mechatronik, title=Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach, volume=15, publisher=Shaker, author=Althoff, Simon, year=2023, collection=Schriften des Lehrstuhls für Dynamik und Mechatronik 
LibreCat: /record/41971

@inproceedingsBorgert_Homberg_2023, title=Analysis of temperature effect on strength and microstructure in friction induced recycling process (FIRP), DOI=10.21741/9781644902479-211, booktitle=Materials Research Proceedings, publisher=Materials Research Forum LLC, author=Borgert, Thomas and Homberg, Werner, year=2023 
LibreCat: /record/44036
DOI: 10.21741/9781644902479-211

@inproceedingsHolzmüller_Linnemann_Homberg_Psyk_Kräusel_Kroos_2023, title=Proof of concept for incremental sheet metal forming by means of electromagnetic and electrohydraulic high-speed forming, volume=25, DOI=10.21741/9781644902417-2, booktitle=Materials Research Proceedings, publisher=Materials Research Forum LLC, author=Holzmüller, Maik and Linnemann, Maik and Homberg, Werner and Psyk, Verena and Kräusel, Verena10.21741/9781644902417-2__and Kroos, Janika, year=2023, pages=11–18 
LibreCat: /record/43044
DOI: 10.21741/9781644902417-2

@articleZhuravlev_Milkereit_Yang_Heiland_Vieth_Voigt_Schaper_Grundmeier_Schick_Kessler_2021, title=Assessment of AlZnMgCu alloy powder modification for crack-free laser powder bed fusion by differential fast scanning calorimetry, DOI=10.1016/j.matdes.2021.109677, number=109677, journal=Materials &; Design, author=Zhuravlev, Evgeny and Milkereit, Benjamin and Yang, Bin and Heiland, Steffen and Vieth, Pascal and Voigt, Markus and Schaper, Mirko and Grundmeier, Guido and Schick, Christoph and Kessler, Olaf, year=2021 
LibreCat: /record/24589
DOI: 10.1016/j.matdes.2021.109677

@bookCamberg_2021, series=Schriftenreihe Institut für Leichtbau mit Hybridsystemen, title=Festigkeitssteigerung von Aluminiumblechformteilen der 5000-Serie durch Erweiterung der Formgebungsgrenzen stark kaltverfestigter Ausgangswerkstoffe, volume=2021,52, DOI=10.2370/9783844082715, publisher=Shaker Verlag, author=Camberg, Alan Adam, year=2021, collection=Schriftenreihe Institut für Leichtbau mit Hybridsystemen 
LibreCat: /record/37579
DOI: 10.2370/9783844082715

@articleSchemmel_Krieger_Hemsel_Sextro_2021, title=Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization, volume=119, DOI=https://doi.org/10.1016/j.microrel.2021.114077, journal=Microelectronics Reliability, author=Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter, year=2021, pages=114077 
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077

@articleUhe_Kuball_Merklein_Meschut_2020, title=Improvement of a rivet geometry for the self-piercing riveting of high-strength steel and multi-material joints, volume=14, DOI=10.1007/s11740-020-00973-w, journal=Production Engineering, author=Uhe, Benedikt and Kuball, Clara-Maria and Merklein, Marion and Meschut, Gerson, year=2020, pages=417–423 
LibreCat: /record/19973
DOI: 10.1007/s11740-020-00973-w

@inproceedingsUnger_Hunstig_Meyer_Brökelmann_Sextro_2018, title=Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges, volume=Vol. 2018, No. 1, pp. 000572-000577., DOI=10.4071/2380-4505-2018.1.000572, booktitle=In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, author=Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter, year=2018 
LibreCat: /record/9999
DOI: 10.4071/2380-4505-2018.1.000572

@articleRösener_Hoffmann_Herres-Pawlis_2018, title=Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility, volume=2018, DOI=10.1002/ejic.201800511, number=27, journal=European Journal of Inorganic Chemistry, author=Rösener, Thomas and Hoffmann, Alexander and Herres-Pawlis, Sonja, year=2018, pages=3164–3175 
LibreCat: /record/13186
DOI: 10.1002/ejic.201800511

@articleOppermann_Laurini_Etscheidt_Hollmann_Strassl_Hoffmann_Schurr_Dittmeyer_Rinke_Herres-Pawlis_2017, title=Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer, volume=40, DOI=10.1002/ceat.201600691, number=8, journal=Chemical Engineering \'26; Technology, author=Oppermann, Alexander and Laurini, Larissa and Etscheidt, Fabian and Hollmann, Katharina and Strassl, Florian and Hoffmann, Alexander and Schurr, Daniela and Dittmeyer, Roland and Rinke, Günter and Herres-Pawlis, Sonja, year=2017, pages=1475–1483 
LibreCat: /record/13187
DOI: 10.1002/ceat.201600691

@inproceedingsEacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title=Effect of different oxide layers on the ultrasonic copper wire bond process, DOI=10.1109/ECTC.2016.91, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten, year=2016, pages=2111–2118 
LibreCat: /record/9959
DOI: 10.1109/ECTC.2016.91

@inproceedingsMeyer10.1109/ECTC.2016.215Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title=Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation, DOI=10.1109/ECTC.2016.215, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten, year=2016, pages=622–628 
LibreCat: /record/9966
DOI: 10.1109/ECTC.2016.215

@inproceedingsAlthoff_Neuhaus_Hemsel_Sextro_2014, title=Improving the bond quality of copper wire bonds using a friction model approach, DOI=10.1109/ECTC.2014.6897500, booktitle=Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, author=Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter, year=2014, pages=1549–1555 
LibreCat: /record/9868
DOI: 10.1109/ECTC.2014.6897500

@inproceedingsEacock10.4071/isom-THP32Schaper_Althoff_Unger_Eichwald_Hengsbach_Zinn_Holzweissig_Guth_2014, title=Microstructural investigations of aluminum and copper wire bonds, DOI=10.4071/isom-THP32, booktitle=Proceedings of the 47th International Symposium on Microelectronics, author=Eacock , Florian and Schaper, Mirko and Althoff, Simon and Unger, Andreas and Eichwald, Paul and Hengsbach, Florian and Zinn, Carolin and Holzweissig,10.4071/isom-THP32__Martin Joachim and Guth, Karsten, year=2014 
LibreCat: /record/9870
DOI: 10.4071/isom-THP32

@inproceedingsEichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title=Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding, DOI=10.4071/isom-THP34, booktitle=Proceedings of the 47th International Symposium on Microelectronics, author=Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian and Unger, Andreas and Meyer, Tobias and Guth, Karsten, year=2014, pages=856–861 
LibreCat: /record/9871
DOI: 10.4071/isom-THP34

@inproceedingsUnger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place=San Diego, CA, US, title=Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds, booktitle=Proceedings of the 47th International Symposium on Microelectronics (IMAPS), author=Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael, year=2014, pages=289–294 
LibreCat: /record/9895

@articleHerres-Pawlis_Berth_Wiedemeier_Schmidt_Zrenner_Warnecke_2010, title=Oxygen sensing by fluorescence quenching of [Cu(btmgp)I], volume=130, DOI=10.1016/j.jlumin.2010.05.012, number=10, journal=Journal of Luminescence, publisher=Elsevier BV, author=Herres-Pawlis, Sonja and Berth, Gerhard and Wiedemeier, Volker and Schmidt, Ludger and Zrenner, Artur and Warnecke, Hans-Joachim, year=2010, pages=1958–1962 
LibreCat: /record/4548
DOI: 10.1016/j.jlumin.2010.05.012