Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.”https://doi.org/10.1109/ECTC.2016.91__In IEEE 66th Electronic Components and Technology Conference, 2111–18, 2016.https://doi.org/10.1109/ECTC.2016.91 .
LibreCat: /record/9959
DOI: 10.1109/ECTC.2016.91

Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.”https://doi.org/10.1109/ECTC.2016.215__In IEEE 66th Electronic Components and Technology Conference, 622–28, 2016.https://doi.org/10.1109/ECTC.2016.215 .
LibreCat: /record/9966
DOI: 10.1109/ECTC.2016.215

Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.”https://doi.org/10.1109/ECTC.2014.6897500__In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014.https://doi.org/10.1109/ECTC.2014.6897500 .
LibreCat: /record/9868
DOI: 10.1109/ECTC.2014.6897500

Eacock , Florian, Mirko Schaper, Simon Althoff, Andreas Unger, Paul Eichwald, Florian Hengsbach, Carolin Zinn,https://doi.org/10.4071/isom-THP32__Martin Joachim Holzweissig, and Karsten Guth. “Microstructural Investigations of Aluminum and Copper Wire Bonds.”https://doi.org/10.4071/isom-THP32__In Proceedings of the 47th International Symposium on Microelectronics, 2014.https://doi.org/10.4071/isom-THP32 .
LibreCat: /record/9870
DOI: 10.4071/isom-THP32

Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger, Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.”https://doi.org/10.4071/isom-THP34__In Proceedings of the 47th International Symposium on Microelectronics, 856–61, 2014.https://doi.org/10.4071/isom-THP34 .
LibreCat: /record/9871
DOI: 10.4071/isom-THP34

Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 289–94. San Diego, CA, US, 2014.
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Herres-Pawlis, Sonja, Gerhard Berth, Volker Wiedemeier, Ludger Schmidt, Artur Zrenner, and Hans-Joachim Warnecke. “Oxygen Sensing by Fluorescence Quenching of [Cu(Btmgp)I].”https://doi.org/10.1016/j.jlumin.2010.05.012__Journal of Luminescence 130, no. 10 (2010): 1958–62.https://doi.org/10.1016/j.jlumin.2010.05.012 .
LibreCat: /record/4548
DOI: 10.1016/j.jlumin.2010.05.012