@inproceedingsEacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title=Effect of different oxide layers on the ultrasonic copper wire bond process, DOI=10.1109/ECTC.2016.91, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten, year=2016, pages=2111–2118 

@inproceedingsMeyer10.1109/ECTC.2016.215Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title=Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation, DOI=10.1109/ECTC.2016.215, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten, year=2016, pages=622–628 

@inproceedingsAlthoff_Neuhaus_Hemsel_Sextro_2014, title=Improving the bond quality of copper wire bonds using a friction model approach, DOI=10.1109/ECTC.2014.6897500, booktitle=Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, author=Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter, year=2014, pages=1549–1555 

@inproceedingsEacock10.4071/isom-THP32Schaper_Althoff_Unger_Eichwald_Hengsbach_Zinn_Holzweissig_Guth_2014, title=Microstructural investigations of aluminum and copper wire bonds, DOI=10.4071/isom-THP32, booktitle=Proceedings of the 47th International Symposium on Microelectronics, author=Eacock , Florian and Schaper, Mirko and Althoff, Simon and Unger, Andreas and Eichwald, Paul and Hengsbach, Florian and Zinn, Carolin and Holzweissig,10.4071/isom-THP32__Martin Joachim and Guth, Karsten, year=2014 

@inproceedingsEichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title=Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding, DOI=10.4071/isom-THP34, booktitle=Proceedings of the 47th International Symposium on Microelectronics, author=Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian and Unger, Andreas and Meyer, Tobias and Guth, Karsten, year=2014, pages=856–861 

@inproceedingsUnger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place=San Diego, CA, US, title=Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds, booktitle=Proceedings of the 47th International Symposium on Microelectronics (IMAPS), author=Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael, year=2014, pages=289–294 

@articleHerres-Pawlis_Berth_Wiedemeier_Schmidt_Zrenner_Warnecke_2010, title=Oxygen sensing by fluorescence quenching of [Cu(btmgp)I], volume=130, DOI=10.1016/j.jlumin.2010.05.012, number=10, journal=Journal of Luminescence, publisher=Elsevier BV, author=Herres-Pawlis, Sonja and Berth, Gerhard and Wiedemeier, Volker and Schmidt, Ludger and Zrenner, Artur and Warnecke, Hans-Joachim, year=2010, pages=1958–1962