M. Röglinger et al., “Exogenous Shocks and Business Process Management,”10.1007/s12599-021-00740-w__Business &; Information Systems Engineering, vol. 64, no. 5, pp. 669–687, 2022, doi:10.1007/s12599-021-00740-w .

T. Ahlers, F. W. Edossa, M. Uckert, and U. Kosi, Insolvcency Process in Germany and the insol database: A research Note. 2022.

M. Otroshi, G. Meschut, and A. Nesakumar, “The influence of manufacturing processes and optical measurement methods on the damage behavior of LAD micro-alloyed steels,”https://doi.org/10.37255/jme.v16i3pp070-076__Journal of Manufacturing Engineering, vol. 16, no. 3, pp. 70–76, 2021, doi:https://doi.org/10.37255/jme.v16i3pp070-076 .

M. A. R. da Silva et al., “Sustainable oxidation catalysis supported by light: Fe-poly (heptazine imide) as a heterogeneous single-atom photocatalyst,”10.1016/j.apcatb.2021.120965__Applied Catalysis B: Environmental, vol. 304, Art. no. 120965, 2021, doi:10.1016/j.apcatb.2021.120965 .

M. A. R. da Silva et al., “Sustainable oxidation catalysis supported by light: Fe-poly (heptazine imide) as a heterogeneous single-atom photocatalyst,”10.1016/j.apcatb.2021.120965__Applied Catalysis B: Environmental, vol. 304, Art. no. 120965, 2021, doi:10.1016/j.apcatb.2021.120965 .

B. Arian, W. Homberg, M. Riepold, A. Trächtler, J. Rozo Vasquez, and F. Walther, “Forming of metastable austenitic stainless steel tubes with axially graded martensite content by flow-forming,” presented at the 24th International Conference on Material Forming - ESAFORM 2021, Liège, Belgium, 2021.

D. Liu et al., “A composite consisting of intermetallic Ni3Fe and nitrogen-doped carbon for electrocatalytic water oxidation: The effect of increased pyridinic nitrogen dopant,”10.1016/j.ceramint.2021.11.123__Ceramics International, vol. 48, no. 4, pp. 5759–5765, 2021, doi:10.1016/j.ceramint.2021.11.123 .

R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,”https://doi.org/10.1016/j.microrel.2021.114077__Microelectronics Reliability, vol. 119, p. 114077, 2021, doi:https://doi.org/10.1016/j.microrel.2021.114077 .

K. J. Rohlfing et al., “Explanation as a Social Practice: Toward a Conceptual Framework for the Social Design of AI Systems,”10.1109/tcds.2020.3044366__IEEE Transactions on Cognitive and Developmental Systems, vol. 13, no. 3, pp. 717–728, 2021, doi:10.1109/tcds.2020.3044366 .

D. Schroder, S. Lange, C. Hangmann, and C. Hedayat, “Far-field prediction combining simulations with near-field measurements for EMI assessment of PCBs,” in Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis, 1st ed., Croyton, UK:  The Institution of Engineering and Technology (IET), 2020, pp. 315-346 (32).