Althoff, S. (2023). Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach (Vol. 15). Shaker.

Voswinkel, D. (2023). Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties. Journal of Manufacturing Processes, 94, 10–19.https://doi.org//10.1016/j.jmapro.2023.03.056 

Moritzer, E., &; Driediger, C. (2022). Reactive Direct Bonding of Digital Light Process Components. Macromolecular Symposia, 404(1), Article 2100396.https://doi.org/10.1002/masy.202100396 

Hesse, M., Hunstig, M., Timmermann, J., &; Trächtler, A. (2022). Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design. Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 383–394.

Schemmel, R., Krieger, V., Hemsel, T., &; Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077.https://doi.org/10.1016/j.microrel.2021.114077 

Opdemom, H. (2019). Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen: Vol. 2019,35. Shaker Verlag.

Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &; Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical, 295, 653–662.https://doi.org/10.1016/j.sna.2019.04.025 

Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).

Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., &; Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).

Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., &; Sextro, W. (2018). Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.).https://doi.org/10.4071/2380-4505-2018.1.000572 

Schemmel, R., Hemsel, T., &; Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In 43. Deutsche Jahrestagung für Akustik (pp. 611–614). Kiel 2017.

Lücke, A., Gerstmann, U., Kühne, T. D., &; Schmidt, W. G. (2017). Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition. Journal of Computational Chemistry, 38(26), 2276–2282.https://doi.org/10.1002/jcc.24878 

Althoff, S., Meyer, T., Unger, A., Sextro, W., &; Eacock, F. (2016). Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In IEEE 66th Electronic Components and Technology Conference (pp. 2103–2110).https://doi.org/10.1109/ECTC.2016.234 

Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S.,https://doi.org/10.1109/ECTC.2016.91__Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire bond process. In IEEE 66th Electronic Components and Technology Conference (pp. 2111–2118).https://doi.org/10.1109/ECTC.2016.91 

Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S.,  Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016 (pp. 251–254). IEEE CPMT Symposium Japan.

Althoff, S., Neuhaus, J., Hemsel, T., &; Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555).https://doi.org/10.1109/ECTC.2014.6897500 

Eacock , F., Schaper, M., Althoff, S., Unger, A., Eichwald, P., Hengsbach, F.,https://doi.org/10.4071/isom-THP32__Guth, K. (2014). Microstructural investigations of aluminum and copper wire bonds. In Proceedings of the 47th International Symposium on Microelectronics.https://doi.org/10.4071/isom-THP32 

Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., &; Guth, K. (2014). Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In Proceedings of the 47th International Symposium on Microelectronics (pp. 856–861).https://doi.org/10.4071/isom-THP34 

Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., &; Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In Proceedings of the 47th International Symposium on Microelectronics (IMAPS) (pp. 289–294). San Diego, CA, US.

Althoff, S., Neuhaus, J., Hemsel, T., &; Sextro, W. (2013). A friction based approach for modeling wire bonding. In IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA.https://doi.org/10.4071/isom-2013-TA67