Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.
LibreCat: /record/41971

Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties
D. Voswinkel, Journal of Manufacturing Processes 94 (2023) 10–19.
LibreCat: /record/43371
DOI: /10.1016/j.jmapro.2023.03.056

Reactive Direct Bonding of Digital Light Process Components
E. Moritzer, C. Driediger, Macromolecular Symposia 404 (2022).
LibreCat: /record/33988
DOI: 10.1002/masy.202100396

Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design
M. Hesse, M. Hunstig, J. Timmermann, A. Trächtler, in: Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022, pp. 383–394.
LibreCat: /record/29803

Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077

Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen
H. Opdemom, Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen, Shaker Verlag, 2019.
LibreCat: /record/41958

Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.
LibreCat: /record/10334
DOI: 10.1016/j.sna.2019.04.025

Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat: /record/9992

Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat: /record/9993

Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.
LibreCat: /record/9999
DOI: 10.4071/2380-4505-2018.1.000572

MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall
R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.
LibreCat: /record/9982

Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition
A. Lücke, U. Gerstmann, T.D. Kühne, W.G. Schmidt, Journal of Computational Chemistry 38 (2017) 2276–2282.
LibreCat: /record/13238
DOI: 10.1002/jcc.24878

Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.
LibreCat: /record/9955
DOI: 10.1109/ECTC.2016.234

Effect of different oxide layers on the ultrasonic copper wire bond process
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
LibreCat: /record/9959
DOI: 10.1109/ECTC.2016.91

Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
LibreCat: /record/9968

Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
LibreCat: /record/9868
DOI: 10.1109/ECTC.2014.6897500

Microstructural investigations of aluminum and copper wire bonds
F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach, C. Zinn,  Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014.
LibreCat: /record/9870
DOI: 10.4071/isom-THP32

Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding
P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
LibreCat: /record/9871
DOI: 10.4071/isom-THP34

Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
LibreCat: /record/9895

A friction based approach for modeling wire bonding
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.
LibreCat: /record/9797
DOI: 10.4071/isom-2013-TA67