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Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”https://doi.org/10.1016/j.microrel.2021.114077__Microelectronics Reliability 119 (2021): 114077.https://doi.org/10.1016/j.microrel.2021.114077 .

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Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.”https://doi.org/10.1016/j.sna.2019.04.025__Sensors and Actuators A: Physical 295 (2019): 653–62.https://doi.org/10.1016/j.sna.2019.04.025 .

Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 1–6, 2018.

Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44, 2018.

Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.”https://doi.org/10.4071/2380-4505-2018.1.000572__In In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018.https://doi.org/10.4071/2380-4505-2018.1.000572 .

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Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger, Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.”https://doi.org/10.4071/isom-THP34__In Proceedings of the 47th International Symposium on Microelectronics, 856–61, 2014.https://doi.org/10.4071/isom-THP34 .

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